Inventor · disambiguated record
David L. Edwards
Also filed as: EDWARDS DAVID · EDWARDS DAVID L · EDWARDS DAVID LINN · EDWARDS DAVID N
63 granted patents·9 pending applications·2,258 citations·filing 1995–2020
99Inventor score
Top patents by PatentIndex Score
72 records- 0197US6444496B1Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereofIBM·Filed 2000·Granted Sep 3, 2002·123 cites·10 claims
- 0297US5931222AAdhesion promoting layer for bonding polymeric adhesive to metal and a heat sink assembly using sameIBM·Filed 1997·Granted Aug 3, 1999·150 cites·13 claims
- 0396US10660239B2Cooling system with integrated fill and drain pumpIBM·Filed 2017·Granted May 19, 2020·8 cites·17 claims
- 0496US9861013B2Cooling system with integrated fill and drain pumpIBM·Filed 2015·Granted Jan 2, 2018·13 cites·18 claims
- 0596US5623394AApparatus for cooling of chips using a plurality of customized thermally conductive materialsIBM·Filed 1996·Granted Apr 22, 1997·121 cites·18 claims
- 0695US8046616B2Controlling power change for a semiconductor module to preserve thermal interface thereinIBM·Filed 2008·Granted Oct 25, 2011·36 cites·7 claims
- 0794US9918409B2Cooling system with integrated fill and drain pumpIBM·Filed 2015·Granted Mar 13, 2018·9 cites·11 claims
- 0894US7518235B2Method and structure to provide balanced mechanical loading of devices in compressively loaded environmentsIBM·Filed 2005·Granted Apr 14, 2009·42 cites·6 claims
- 0994US7440281B2Thermal interface apparatusAPPLE INC·Filed 2006·Granted Oct 21, 2008·37 cites·38 claims
- 1093US9420728B2Liquid-cooled heat sink configured to facilitate drainageIBM·Filed 2014·Granted Aug 16, 2016·11 cites·9 claims
- 1193US7724527B2Method and structure to improve thermal dissipation from semiconductor devicesIBM·Filed 2008·Granted May 25, 2010·24 cites·20 claims
- 1293US7709951B2Thermal pillowIBM·Filed 2007·Granted May 4, 2010·27 cites·20 claims
- 1393US6294408B1Method for controlling thermal interface gap distanceIBM·Filed 1999·Granted Sep 25, 2001·156 cites·18 claims
- 1493US6292369B1Methods for customizing lid for improved thermal performance of modules using flip chipsIBM·Filed 2000·Granted Sep 18, 2001·82 cites·10 claims
- 1593US5724729AMethod and apparatus for cooling of chips using a plurality of customized thermally conductive materialsIBM·Filed 1996·Granted Mar 10, 1998·71 cites·18 claims
- 1692US7468886B2Method and structure to improve thermal dissipation from semiconductor devicesIBM·Filed 2007·Granted Dec 23, 2008·21 cites·1 claims
- 1792US5604978AMethod for cooling of chips using a plurality of materialsIBM·Filed 1995·Granted Feb 25, 1997·67 cites·17 claims
- 1891US6091603ACustomizable lid for improved thermal performance of modules using flip chipsIBM·Filed 1999·Granted Jul 18, 2000·122 cites·16 claims
- 1990US6275381B1Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereofIBM·Filed 1998·Granted Aug 14, 2001·65 cites·12 claims
- 2089US9743562B2Liquid-cooled heat sink configured to facilitate drainageIBM·Filed 2016·Granted Aug 22, 2017·5 cites·20 claims
- 2189US7268428B2Thermal paste containment for semiconductor modulesIBM·Filed 2005·Granted Sep 11, 2007·25 cites·6 claims
- 2288US7250576B2Chip package having chip extension and methodIBM·Filed 2005·Granted Jul 31, 2007·17 cites·12 claims
- 2387US7079393B2Fluidic cooling systems and methods for electronic componentsIBM·Filed 2004·Granted Jul 18, 2006·44 cites·21 claims
- 2487US6239484B1Underfill of chip-under-chip semiconductor modulesIBM·Filed 1999·Granted May 29, 2001·88 cites·18 claims
- 2586US7464462B2Method of forming anisotropic heat spreading apparatus for semiconductor devicesIBM·Filed 2007·Granted Dec 16, 2008·12 cites·5 claims
- 2686US7376852B2Method for controlling power change for a semiconductor moduleIBM·Filed 2003·Granted May 20, 2008·35 cites·17 claims
- 2786US7328508B2Anisotropic heat spreading apparatus and method for semiconductor devicesIBM·Filed 2005·Granted Feb 12, 2008·13 cites·5 claims
- 2885US9021782B1Aerospace laser ignition/ablation variable high precision thrusterCAMPBELL JONATHAN W·Filed 2010·Granted May 5, 2015·23 cites·27 claims
- 2984US5821161ACast metal seal for semiconductor substrates and process thereofIBM·Filed 1997·Granted Oct 13, 1998·79 cites·21 claims
- 3083US5982038ACast metal seal for semiconductor substratesIBM·Filed 1997·Granted Nov 9, 1999·71 cites·17 claims
- 3183US5819402AMethod for cooling of chips using blind holes with customized depthIBM·Filed 1997·Granted Oct 13, 1998·63 cites·16 claims
- 3282US5981310AMulti-chip heat-sink cap assemblyIBM·Filed 1998·Granted Nov 9, 1999·59 cites·11 claims
- 3381US8582297B2Customized thermal interface to optimize mechanical loading and thermal conductivity characteristicsEDWARDS DAVID L·Filed 2011·Granted Nov 12, 2013·6 cites·20 claims
- 3480US9743561B2Liquid-cooled heat sink configured to facilitate drainageIBM·Filed 2016·Granted Aug 22, 2017·2 cites·13 claims
- 3580US7733655B2Lid edge capping loadIBM·Filed 2008·Granted Jun 8, 2010·11 cites·16 claims
- 3680US5706171AFlat plate cooling using a thermal paste retainerIBM·Filed 1995·Granted Jan 6, 1998·53 cites·18 claims
- 3779US5881945AMulti-layer solder seal band for semiconductor substrates and processIBM·Filed 1997·Granted Mar 16, 1999·57 cites·26 claims
- 3878US5881944AMulti-layer solder seal band for semiconductor substratesIBM·Filed 1997·Granted Mar 16, 1999·53 cites·21 claims
- 3978US5757620AApparatus for cooling of chips using blind holes with customized depthIBM·Filed 1996·Granted May 26, 1998·50 cites·26 claims
- 4077US6451155B1Method using a thin adhesion promoting layer for bonding silicone elastomeric material to nickel and use thereof in making a heat sink assemblyIBM·Filed 1996·Granted Sep 17, 2002·31 cites·10 claims
- 4173US8531025B2Thermal paste containment for semiconductor modulesEDWARDS DAVID L·Filed 2007·Granted Sep 10, 2013·9 cites·15 claims
- 4272US8021925B2Thermal paste containment for semiconductor modulesIBM·Filed 2007·Granted Sep 20, 2011·9 cites·16 claims
- 4371US7687894B2IC chip package having automated tolerance compensationIBM·Filed 2006·Granted Mar 30, 2010·4 cites·4 claims
- 4470US7900809B2Solder interconnection array with optimal mechanical integrityIBM·Filed 2008·Granted Mar 8, 2011·3 cites·13 claims
- 4570US6373133B1Multi-chip module and heat-sink cap combinationIBM·Filed 1999·Granted Apr 16, 2002·34 cites·15 claims
- 4669US6291267B1Process for underfilling chip-under-chip semiconductor modulesIBM·Filed 1999·Granted Sep 18, 2001·33 cites·19 claims
- 4769US5891755AProcess for flat plate cooling a semiconductor chip using a thermal paste retainerIBM·Filed 1997·Granted Apr 6, 1999·31 cites·4 claims
- 4868US11240168B2System and method to exchange identity governance data across multiple identity repositoriesIBM·Filed 2020·Granted Feb 1, 2022·1 cites·20 claims
- 4968US8248805B2System to improve an in-line memory moduleBRANDON MARK A·Filed 2009·Granted Aug 21, 2012·9 cites·9 claims
- 5067US7086896B2Expandable standoff connector with slit collar and related methodIBM·Filed 2004·Granted Aug 8, 2006·12 cites·18 claims
Showing the top 50 of 72 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →