Inventor · disambiguated record
Dan Etter
Also filed as: ETTER DAN
1 granted patent·3 pending applications·0 citations·filing 2021–2025
14Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0177US2025379128A1Ipd Components Having Sic Substrates And Devices And Processes Implementing The SameMACOM TECH SOLUTIONS HOLDINGS INC·Filed 2025·Application pending·0 cites
- 0267US12417966B2IPD components having SiC substrates and devices and processes implementing the sameWOLFSPEED INC·Filed 2021·Granted Sep 16, 2025·0 cites·34 claims
- 0352US2024421053A1Packaged device having an integrated passive device with wafer level formed connection to at least one semiconductor device and processes for implementing the sameWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 0449US2024105763A1Metal-insulator-metal capacitor device with integrated wire bonding surfaceWOLFSPEED INC·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →