Inventor · disambiguated record
Daniel J. Ferguson
Also filed as: FERGUSON DANIEL J · FERGUSON DANIEL JAMES
11 granted patents·411 citations·filing 1981–2018
92Inventor score
Top patents by PatentIndex Score
11 records- 0195US4755403AProtective patch for shrinkable bagGRACE W R & CO CRYOVAC DIV·Filed 1987·Granted Jul 5, 1988·110 cites·31 claims
- 0293US4640856AMulti-layer packaging film and receptacles made therefromGRACE W R & CO CRYOVAC DIV·Filed 1985·Granted Feb 3, 1987·117 cites·18 claims
- 0384US4390385AHeat sealable, multi-ply polypropylene filmGRACE W R & CO CRYOVAC DIV·Filed 1981·Granted Jun 28, 1983·41 cites·4 claims
- 0477US4770731AMethod of making a patch for a shrinkable bagGRACE W R & CO·Filed 1987·Granted Sep 13, 1988·52 cites·6 claims
- 0569US4765857AProtective patch for shrinkable bagGRACE W R & CO CRYOVAC DIV·Filed 1987·Granted Aug 23, 1988·39 cites·6 claims
- 0668US5234731AThermoplastic multi-layer packaging film and bags made therefrom having two layers of very low density polyethyleneGRACE W R & CO·Filed 1990·Granted Aug 10, 1993·36 cites·15 claims
- 0760US11505777B2Biological processing assemblyEXTRACT TECH LIMITED·Filed 2018·Granted Nov 22, 2022·1 cites·10 claims
- 0838US5471033AProcess and apparatus for contamination-free processing of semiconductor partsIBM·Filed 1994·Granted Nov 28, 1995·7 cites·12 claims
- 0932US5550351AProcess and apparatus for contamination-free processing of semiconductor partsIBM·Filed 1995·Granted Aug 27, 1996·2 cites·10 claims
- 1030US5587095AProcess and apparatus for contamination-free processing of semiconductor partsIBM·Filed 1995·Granted Dec 24, 1996·1 cites·12 claims
- 1130US4778715AInter-ply adhesion between saran and linear ethylene copolymersGRACE W R & CO CRYOVAC DIV·Filed 1987·Granted Oct 18, 1988·5 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →