Inventor · disambiguated record
Daniel Francis
Also filed as: FRANCIS DANIEL · FRANCIS DANIEL L
22 granted patents·9 pending applications·233 citations·filing 1984–2024
95Inventor score
Top patents by PatentIndex Score
31 records- 0195US7595507B2Semiconductor devices having gallium nitride epilayers on diamond substratesGROUP4 LABS LLC·Filed 2006·Granted Sep 29, 2009·48 cites·13 claims
- 0292US8674405B1Gallium—nitride-on-diamond wafers and devices, and methods of manufactureBABIC DUBRAVKO·Filed 2012·Granted Mar 18, 2014·24 cites·14 claims
- 0391US8283672B2Semiconductor devices having gallium nitride epilayers on diamond substratesFRANCIS DANIEL·Filed 2009·Granted Oct 9, 2012·14 cites·21 claims
- 0490US8945966B2Method for manufacturing semiconductor devices having gallium nitride epilayers on diamond substrates using intermediate nucleating layerFRANCIS DANIEL·Filed 2012·Granted Feb 3, 2015·8 cites·22 claims
- 0589US8759134B2Gallium-nitride-on-diamond wafers and devices, and methods of manufactureELEMENT SIX TECHNOLOGIES US CORP·Filed 2014·Granted Jun 24, 2014·11 cites·15 claims
- 0688US10043700B2Method of fabricating diamond-semiconductor composite substratesRFHIC CORP·Filed 2016·Granted Aug 7, 2018·7 cites·15 claims
- 0788US9359693B2Gallium-nitride-on-diamond wafers and manufacturing equipment and methods of manufactureELEMENT SIX TECHNOLOGIES US CORP·Filed 2013·Granted Jun 7, 2016·17 cites·5 claims
- 0888US8283189B2Method for manufacturing semiconductor devices having gallium nitride epilayers on diamond substratesFRANCIS DANIEL·Filed 2009·Granted Oct 9, 2012·9 cites·29 claims
- 0985US7943485B2Composite wafers having bulk-quality semiconductor layers and method of manufacturing thereofGROUP4 LABS LLC·Filed 2008·Granted May 17, 2011·17 cites·29 claims
- 1080US10985082B2Apparatus for efficient high-frequency communicationsAKASH SYSTEMS INC·Filed 2020·Granted Apr 20, 2021·1 cites·25 claims
- 1177US2025309037A1Apparatus for efficient high-frequency communicationsAKASH SYSTEMS INC·Filed 2024·Application pending·0 cites
- 1276US11404300B2Mounting of semiconductor-on-diamond wafers for device processingRFHIC CORP·Filed 2020·Granted Aug 2, 2022·1 cites·16 claims
- 1370US4659699AProcess for freeze drying cyclophosphamideCETUS BEN VENUE THERAPEUTICS·Filed 1984·Granted Apr 21, 1987·33 cites·21 claims
- 1469US4797388APharmaceutical compositions with galactitol as carrierCETUS CORP·Filed 1986·Granted Jan 10, 1989·14 cites·16 claims
- 1566US11495515B2Wireless communication system with improved thermal performanceAKASH SYSTEMS INC·Filed 2020·Granted Nov 8, 2022·0 cites·22 claims
- 1663US9882007B2Handle for semiconductor-on-diamond wafers and method of manufactureRFHIC CORP·Filed 2013·Granted Jan 30, 2018·2 cites·16 claims
- 1760US10699896B2Methods for fabricating semiconductor devices that have polycrystalline CVD diamondRFHIC CORP·Filed 2019·Granted Jun 30, 2020·0 cites·20 claims
- 1857US10446468B2Method of fabricating compound semiconductor device structures having polycrstalline CVD diamondRFHIC CORP·Filed 2019·Granted Oct 15, 2019·0 cites·16 claims
- 1956US2024170362A1Devices having and methods of forming thermally conductive substratesAKASH SYSTEMS INC·Filed 2023·Application pending·0 cites
- 2055US2023420333A1Substrate features in thermally conductive materialsAKASH SYSTEMS INC·Filed 2023·Application pending·0 cites
- 2151US10319580B2Compound semiconductor device structures comprising polycrystalline CVD diamondRFHIC CORP·Filed 2015·Granted Jun 11, 2019·0 cites·18 claims
- 2251US2023411314A1High-efficiency structures for improved wireless communicationsAKASH SYSTEMS INC·Filed 2022·Application pending·0 cites
- 2351US2022189846A1Material growth on wide-bandgap semiconductor materialsAKASH SYSTEMS INC·Filed 2021·Application pending·0 cites
- 2450US4923876AVinca alkaloid pharmaceutical compositionsCETUS CORP·Filed 1988·Granted May 8, 1990·19 cites·8 claims
- 2548US10586850B2Handle for semiconductor-on-diamond wafers and method of manufactureRFHIC CORP·Filed 2017·Granted Mar 10, 2020·0 cites·22 claims
- 2645US10297526B2Compound semiconductor device structures comprising polycrystalline CVD diamondRFHIC CORP·Filed 2015·Granted May 21, 2019·0 cites·17 claims
- 2743US2018315637A1Mounting of semiconductor-on-diamond wafers for device processingRFHIC CORP·Filed 2016·Application pending·0 cites
- 2841US2007269604A1Method for manufacturing smooth diamond heat sinksFRANCIS DANIEL·Filed 2007·Application pending·0 cites
- 2938US2015279945A1Semiconductor devices with improved reliability and operating life and methods of manufactuirng the sameFRANCIS DANIEL·Filed 2013·Application pending·0 cites
- 3038US2019214260A1Bonding of diamond wafers to carrier substratesELEMENT SIX TECH LTD·Filed 2017·Application pending·0 cites
- 3131US5201147AMarine battery terminal cleaner toolFRANCIS DANIEL L·Filed 1992·Granted Apr 13, 1993·8 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →