Inventor · disambiguated record
Daiki Furuyama
Also filed as: FURUYAMA DAIKI
0 granted patents·2 pending applications·0 citations·filing 2022–2022
Files withMITSUBISHI MATERIALS CORP2
Top patents by PatentIndex Score
2 records- 0156US2025003102A1Acidic electrolytic copper plating liquid, method for forming preform layer, method for producing joining sheet, method for producing joining substrate, and method for producing joined bodyMITSUBISHI MATERIALS CORP·Filed 2022·Application pending·0 cites
- 0239US2024300215A1Bonding sheet with preform layer, method for manufacturing bonded body, and to-be-bonded member with preform layerMITSUBISHI MATERIALS CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →