Inventor · disambiguated record
David B. Goland
Also filed as: GOLAND DAVID B · GOLAND DAVID BRIAN
26 granted patents·591 citations·filing 1989–2002
97Inventor score
Files withIBM26
Top patents by PatentIndex Score
26 records- 0190US6262390B1Repair process for aluminum nitride substratesIBM·Filed 1998·Granted Jul 17, 2001·66 cites·24 claims
- 0290US5480503AProcess for producing circuitized layers and multilayer ceramic sub-laminates and composites thereofIBM·Filed 1993·Granted Jan 2, 1996·127 cites·11 claims
- 0390US5177594ASemiconductor chip interposer module with engineering change wiring and distributed decoupling capacitanceIBM·Filed 1991·Granted Jan 5, 1993·137 cites·8 claims
- 0482US5981310AMulti-chip heat-sink cap assemblyIBM·Filed 1998·Granted Nov 9, 1999·59 cites·11 claims
- 0570US6373133B1Multi-chip module and heat-sink cap combinationIBM·Filed 1999·Granted Apr 16, 2002·34 cites·15 claims
- 0652US5292477ASupersaturation method for producing metal powder with a uniform distribution of dispersants method of uses thereof and structures fabricated therewithIBM·Filed 1992·Granted Mar 8, 1994·20 cites·26 claims
- 0752US5147484AMethod for producing multi-layer ceramic substrates with oxidation resistant metalizationIBM·Filed 1991·Granted Sep 15, 1992·21 cites·18 claims
- 0850US6352014B1Method for making punches using multi-layer ceramic technologyIBM·Filed 1999·Granted Mar 5, 2002·12 cites·42 claims
- 0949US6652956B2X-ray printing personalization techniqueIBM·Filed 2001·Granted Nov 25, 2003·2 cites·9 claims
- 1049US6096565AMulti-layer glass ceramic module with superconductor wiringIBM·Filed 1999·Granted Aug 1, 2000·14 cites·5 claims
- 1147US5763093AAluminum nitride body having graded metallurgyIBM·Filed 1996·Granted Jun 9, 1998·10 cites·11 claims
- 1245US5682589AAluminum nitride body having graded metallurgyIBM·Filed 1996·Granted Oct 28, 1997·9 cites·12 claims
- 1345US5552107AAluminum nitride body having graded metallurgyIBM·Filed 1995·Granted Sep 3, 1996·9 cites·6 claims
- 1444US5932043AMethod for flat firing aluminum nitride/tungsten electronic modulesIBM·Filed 1997·Granted Aug 3, 1999·12 cites·53 claims
- 1544US5759669AApparatus and method for screening green sheet with via hole using porous backing materialIBM·Filed 1995·Granted Jun 2, 1998·14 cites·19 claims
- 1643US6638681B2X-ray printing personalization techniqueIBM·Filed 2002·Granted Oct 28, 2003·0 cites·12 claims
- 1740US5169310AHermetic package for an electronic device and method of manufacturing sameIBM·Filed 1991·Granted Dec 8, 1992·10 cites·5 claims
- 1838US5194196AHermetic package for an electronic device and method of manufacturing sameIBM·Filed 1989·Granted Mar 16, 1993·8 cites·12 claims
- 1937US6004624AMethod for the controlling of certain second phases in aluminum nitrideIBM·Filed 1997·Granted Dec 21, 1999·5 cites·6 claims
- 2036US6002951AMulti-layer ceramic substrate having high TC superconductor circuitryIBM·Filed 1997·Granted Dec 14, 1999·5 cites·8 claims
- 2134US6200373B1Method for controlling of certain second phases in aluminum nitrideIBM·Filed 1999·Granted Mar 13, 2001·3 cites·9 claims
- 2234US5552232AAluminum nitride body having graded metallurgyIBM·Filed 1994·Granted Sep 3, 1996·4 cites·10 claims
- 2332US5891543AApparatus and method for screening using electrostatic adhesionIBM·Filed 1996·Granted Apr 6, 1999·3 cites·12 claims
- 2432US5635000AMethod for screening using electrostatic adhesionIBM·Filed 1995·Granted Jun 3, 1997·3 cites·7 claims
- 2532US5245136AHermetic package for an electronic deviceIBM·Filed 1991·Granted Sep 14, 1993·4 cites·5 claims
- 2629US6306528B1Method for the controlling of certain second phases in aluminum nitrideIBM·Filed 1999·Granted Oct 23, 2001·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →