Inventor · disambiguated record
Dan Gong
Also filed as: GONG DAN · GONG DAN-BO
6 granted patents·2 pending applications·6 citations·filing 2011–2022
70Inventor score
Files withJ METRICS TECH CO LTD5GONG DAN-BO1SONICMEMS ZHENGZHOU TECH CO LTD1STATE GRID JIANGSU ELECTRIC POWER CO LTD MARKETING SERVICE CENTER1
Top patents by PatentIndex Score
8 records- 0190US11075072B2Wafer scale ultrasonic sensing device and manufacturing method thereofJ METRICS TECH CO LTD·Filed 2020·Granted Jul 27, 2021·3 cites·11 claims
- 0282US11460341B2Wafer scale ultrasonic sensor assembly and method for manufacturing the sameJ METRICS TECH CO LTD·Filed 2019·Granted Oct 4, 2022·3 cites·20 claims
- 0365US2023014827A1Wafer level ultrasonic chip module having suspension structureJ METRICS TECH CO LTD·Filed 2022·Application pending·0 cites
- 0451US11478822B2Wafer level ultrasonic chip module having suspension structure and manufacturing method thereofJ METRICS TECH CO LTD·Filed 2019·Granted Oct 25, 2022·0 cites·7 claims
- 0547US11130674B2Integrated package structure for MEMS element and ASIC chip and method for manufacturing the sameJ METRICS TECH CO LTD·Filed 2020·Granted Sep 28, 2021·0 cites·9 claims
- 0642US11821929B2Quasi-real-time data collection system and method for competitive power marketSTATE GRID JIANGSU ELECTRIC POWER CO LTD MARKETING SERVICE CENTER·Filed 2021·Granted Nov 21, 2023·0 cites·15 claims
- 0736US11590536B2Wafer level ultrasonic chip module and manufacturing method thereofSONICMEMS ZHENGZHOU TECH CO LTD·Filed 2019·Granted Feb 28, 2023·0 cites·7 claims
- 0833US2012071150A1Call management method for mobile phoneGONG DAN-BO·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →