Inventor · disambiguated record
Daniel S. Green
Also filed as: GREEN DANIEL · GREEN DANIEL S · Green Daniel Somerset
11 granted patents·5 pending applications·11 citations·filing 2017–2025
84Inventor score
Files withPSEUDOLITHIC INC14THE UNITED STATE OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE NAVY1UNIV ILLINOIS1
Top patents by PatentIndex Score
16 records- 0193US11756848B1Chip integration into cavities of a host wafer using lateral dielectric material bondingPSEUDOLITHIC INC·Filed 2023·Granted Sep 12, 2023·3 cites·13 claims
- 0292US11810876B1Heterogeneous integration of radio frequency transistor chiplets having interconnection tuning circuitsPSEUDOLITHIC INC·Filed 2023·Granted Nov 7, 2023·2 cites·20 claims
- 0387US11733297B1Built in self-test of heterogeneous integrated radio frequency chipletsPSEUDOLITHIC INC·Filed 2023·Granted Aug 22, 2023·1 cites·21 claims
- 0482US12191295B1Heterogeneous integration of radio frequency transistor chiplets having interconnections to host wafer circuits for optimizing operating conditionsPSEUDOLITHIC INC·Filed 2024·Granted Jan 7, 2025·0 cites·24 claims
- 0580US2025391826A1Heterogeneous integration of radio frequency transistor chiplets having interconnections to wafer circuits for optimizing operating conditionsPSEUDOLITHIC INC·Filed 2025·Application pending·0 cites
- 0677US12261091B2Chip integration into cavities of a host wafer using lateral dielectric material bondingPSEUDOLITHIC INC·Filed 2023·Granted Mar 25, 2025·0 cites·24 claims
- 0777US12125759B2Chip integration into cavities of a host wafer using lateral dielectric material bondingPSEUDOLITHIC INC·Filed 2023·Granted Oct 22, 2024·0 cites·20 claims
- 0877US12099092B1Built in self-test of heterogeneous integrated radio frequency chipletsPSEUDOLITHIC INC·Filed 2023·Granted Sep 24, 2024·0 cites·21 claims
- 0976US11940495B1Built in self-test of heterogeneous integrated radio frequency chipletsPSEUDOLITHIC INC·Filed 2023·Granted Mar 26, 2024·0 cites·21 claims
- 1076US2025218882A1Chip integration into cavities of a host wafer using lateral dielectric material bondingPSEUDOLITHIC INC·Filed 2025·Application pending·0 cites
- 1174US10262856B2Selective oxidation of transition metal nitride layers within compound semiconductor device structuresTHE UNITED STATE OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE NAVY·Filed 2017·Granted Apr 16, 2019·3 cites·22 claims
- 1274US9837483B2Nanoscale high-performance topological inductorUNIV ILLINOIS·Filed 2017·Granted Dec 5, 2017·2 cites·20 claims
- 1371US12322714B2Heterogeneous integration of radio frequency transistor chiplets having interconnection tuning circuitsPSEUDOLITHIC INC·Filed 2023·Granted Jun 3, 2025·0 cites·18 claims
- 1471US2025285997A1Heterogeneous integration of radio frequency transistor chiplets having interconnection tuning circuitsPSEUDOLITHIC INC·Filed 2025·Application pending·0 cites
- 1569US2025391824A1Heterogeneous integration of radio frequency transistor chiplets having interconnections to host wafer circuits for optimizing operating conditionsPSEUDOLITHIC INC·Filed 2025·Application pending·0 cites
- 1660US2024304508A1Multi-thickness chip integration into cavities of a host wafer using lateral dielectric materialPSEUDOLITHIC INC·Filed 2024·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Daniel S. Green files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →