Inventor · disambiguated record
Darko Grujicic
Also filed as: Grujicic Darko
12 granted patents·40 pending applications·2 citations·filing 2015–2024
80Inventor score
Top patents by PatentIndex Score
52 records- 0175US11791228B2Method for forming embedded grounding planes on interconnect layersINTEL CORP·Filed 2019·Granted Oct 17, 2023·2 cites·17 claims
- 0261US12057252B2Electronic substrates having embedded inductorsINTEL CORP·Filed 2020·Granted Aug 6, 2024·0 cites·11 claims
- 0359US12349282B2Capacitors in through glass viasINTEL CORP·Filed 2021·Granted Jul 1, 2025·0 cites·23 claims
- 0458US2025210506A1Passivation boundary defects for reduced leakage current capacitor dielectric materialsINTEL CORP·Filed 2023·Application pending·0 cites
- 0558US2025218956A1Methods and apparatus for mounting semiconductor devices in cavitiesINTEL CORP·Filed 2023·Application pending·0 cites
- 0657US12399006B2Agitation monitoring system for plating processINTEL CORP·Filed 2022·Granted Aug 26, 2025·0 cites·17 claims
- 0757US2025279346A1High aspect ratio vias with low stress in integrated circuit packagesINTEL CORP·Filed 2024·Application pending·0 cites
- 0856US2025006781A1Carbon nanofiber capacitor apparatus and related methodsINTEL CORP·Filed 2023·Application pending·0 cites
- 0956US2025006671A1Semiconductor layer with dry deposition layerINTEL CORP·Filed 2023·Application pending·0 cites
- 1055US12159825B2Dielectric-to-metal adhesion promotion materialINTEL CORP·Filed 2021·Granted Dec 3, 2024·0 cites·20 claims
- 1155US2025006646A1Through glass vias with compliant layer for integrated circuit device packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 1254US2024213132A1Thin film capacitors (tfcs) in etched back deep viaINTEL CORP·Filed 2022·Application pending·0 cites
- 1354US2024321657A1Photonic integrated circuit packages and methods of manufacturing the sameINTEL CORP·Filed 2023·Application pending·0 cites
- 1454US2025309148A1Substrate with component embedded in a blind cavityINTEL CORP·Filed 2024·Application pending·0 cites
- 1553US2025106997A1Electroless seed layer deposition on glass core substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 1653US2025014954A1Hybrid cores including adhesive promotion layers and related methodsAGARWAL SOHAM·Filed 2024·Application pending·0 cites
- 1752US2024395661A1In-situ micro-fluidic channels for heat dissipation in glass substrateINTEL CORP·Filed 2023·Application pending·0 cites
- 1852US2024006380A1Metallization surface treatment for integrated circuit packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 1952US2024222035A1Package substrate embedded multi-layered in via capacitorsINTEL CORP·Filed 2022·Application pending·0 cites
- 2052US2024006327A1Integrated circuit package with multi-layered metallization linesINTEL CORP·Filed 2022·Application pending·0 cites
- 2152US2024006283A1Edge delamination and crack prevention methods for sinx and ti-cu enabled packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 2252US2025112163A1Through-glass via liners for integrated circuit device packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 2352US2024006297A1Silicide and silicon nitride layers between a dielectric and copperINTEL CORP·Filed 2022·Application pending·0 cites
- 2452US2024222018A1Substrate package-integrated oxide capacitors and related methodsINTEL CORP·Filed 2022·Application pending·0 cites
- 2551US12476175B2Glass substrates having transverse capacitors for use with semiconductor packages and related methodsINTEL CORP·Filed 2021·Granted Nov 18, 2025·0 cites·17 claims
- 2651US2023420322A1Organic adhesion promotor for dielectric adhesion to a copper traceINTEL CORP·Filed 2022·Application pending·0 cites
- 2751US2024312853A1Via structures in bonded glass substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 2851US2024312888A1Via structures in bonded glass substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 2951US2024213301A1Thin film capacitor (tfc) architectures for package substratesINTEL CORP·Filed 2022·Application pending·0 cites
- 3051US2025006614A1Intervening layers for thru-via seed metallizationSHANMUGAM RENGARAJAN·Filed 2023·Application pending·0 cites
- 3151US2023402368A1Technologies for thin film resistors in viasINTEL CORP·Filed 2022·Application pending·0 cites
- 3251US2025183182A1Microelectronic assemblies with through-glass via stress alleviation in glass coresSHAN BOHAN·Filed 2023·Application pending·0 cites
- 3350US2024006300A1Substrates having adhesion promotor layers and related methodsINTEL CORP·Filed 2022·Application pending·0 cites
- 3450US2024006258A1Substrates with nitrided glass coresINTEL CORP·Filed 2022·Application pending·0 cites
- 3550US2024327201A1Mems dies embedded in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 3649US12159844B2Electronic substrates having embedded inductorsINTEL CORP·Filed 2020·Granted Dec 3, 2024·0 cites·20 claims
- 3749US2023093438A1Glass substrate embedded pic to pic and off-chip photonic communicationsINTEL CORP·Filed 2021·Application pending·0 cites
- 3849US2024332153A1Dry seed removal by laser for line-space and via formationINTEL CORP·Filed 2023·Application pending·0 cites
- 3949US2024188222A1Method of forming a package substrateINTEL CORP·Filed 2022·Application pending·0 cites
- 4048US11574993B2Package architecture with tunable magnetic properties for embedded devicesINTEL CORP·Filed 2019·Granted Feb 7, 2023·0 cites·15 claims
- 4148US2024222258A1Glass substrates with self-assembled monolayers for copper adhesionINTEL CORP·Filed 2022·Application pending·0 cites
- 4247US12416093B2Electroless plating processINTEL CORP·Filed 2021·Granted Sep 16, 2025·0 cites·13 claims
- 4345US2023107096A1Through glass via with a metal wallINTEL CORP·Filed 2021·Application pending·0 cites
- 4444US2023082385A1Defect-free through glass via metallization implementing a reverse filling architectureECTON JEREMY D·Filed 2021·Application pending·0 cites
- 4544US2022093534A1Electronic substrates having embedded inductorsINTEL CORP·Filed 2020·Application pending·0 cites
- 4644US2023298971A1Microelectronic structure including conductive polymer in trenches of a core substrate, and method of making sameINTEL CORP·Filed 2022·Application pending·0 cites
- 4743US11501967B2Selective metal deposition by patterning direct electroless metal platingINTEL CORP·Filed 2019·Granted Nov 15, 2022·0 cites·12 claims
- 4841US11728265B2Selective deposition of embedded thin-film resistors for semiconductor packagingINTEL CORP·Filed 2018·Granted Aug 15, 2023·0 cites·15 claims
- 4941US11291122B2Apparatus with a substrate provided with plasma treatmentINTEL CORP·Filed 2017·Granted Mar 29, 2022·0 cites·14 claims
- 5039US2021090946A1Multiple layer copper seedingINTEL CORP·Filed 2019·Application pending·0 cites
Showing the top 50 of 52 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →