Inventor · disambiguated record
Dale Hackitt
Also filed as: HACKITT DALE · HACKITT DALE A
6 granted patents·2 pending applications·150 citations·filing 1995–2012
85Inventor score
Technology areasH10W
Top patents by PatentIndex Score
8 records- 0196US8890628B2Ultra slim RF package for ultrabooks and smart phonesNAIR VIJAY K·Filed 2012·Granted Nov 18, 2014·72 cites·29 claims
- 0278US7372133B2Microelectronic package having a stiffening element and method of making sameINTEL CORP·Filed 2005·Granted May 13, 2008·9 cites·15 claims
- 0372US7190068B2Bottom heat spreaderINTEL CORP·Filed 2004·Granted Mar 13, 2007·19 cites·26 claims
- 0466US6972152B2Use of direct gold surface finish on a copper wire-bond substrate, methods of making same, and methods of testing sameINTEL CORP·Filed 2003·Granted Dec 6, 2005·19 cites·24 claims
- 0565US7638867B2Microelectronic package having solder-filled through-viasINTEL CORP·Filed 2006·Granted Dec 29, 2009·3 cites·14 claims
- 0660US5489805ASlotted thermal dissipater for a semiconductor packageINTEL CORP·Filed 1995·Granted Feb 6, 1996·28 cites·4 claims
- 0737US2006012042A1Use of direct gold surface finish on a copper wire-bond substrate, methods of making same, and methods of testing sameINTEL CORP·Filed 2005·Application pending·0 cites
- 0837US2007275540A1Backside via formation prior to die attachmentHACKITT DALE A·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →