Inventor · disambiguated record
Daewoong Heo
Also filed as: HEO DAEWOONG
1 granted patent·6 pending applications·0 citations·filing 2022–2025
6Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD7
Top patents by PatentIndex Score
7 records- 0150US2025336748A1Semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0242US12154883B2Apparatus for bonding wireSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 26, 2024·0 cites·20 claims
- 0341US2024363581A1Wire bonding apparatus and semiconductor package manufactured using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0440US2024213175A1Semiconductor package having alignment patternSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0537US2024087983A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0636US2023395358A1Semiconductor substrate processing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0733US2025357453A1Semiconductor PackageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →