Inventor · disambiguated record
Daryl R. Heussner
Also filed as: HEUSSNER DARYL R
2 granted patents·1 pending application·0 citations·filing 2007–2019
27Inventor score
Files withTEXAS INSTRUMENTS INC3
Top patents by PatentIndex Score
3 records- 0151US11430719B2Spot-solderable leads for semiconductor device packagesTEXAS INSTRUMENTS INC·Filed 2019·Granted Aug 30, 2022·0 cites·6 claims
- 0251US10607927B2Spot-solderable leads for semiconductor device packagesTEXAS INSTRUMENTS INC·Filed 2017·Granted Mar 31, 2020·0 cites·8 claims
- 0333US2008246491A1Scalable method for identifying cracks and fractures under wired or ball bonded bond padsTEXAS INSTRUMENTS INC·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →