Inventor · disambiguated record
Daisuke Hieda
Also filed as: HIEDA DAISUKE
2 granted patents·2 pending applications·1 citations·filing 2016–2025
33Inventor score
Files withSUMCO CORP4
Top patents by PatentIndex Score
4 records- 0167US2025357186A1Method for producing support substrate for bonded wafer, and support substrate for bonded waferSUMCO CORP·Filed 2025·Application pending·0 cites
- 0257US12400909B2Method for producing support substrate for bonded wafer, and support substrate for bonded waferSUMCO CORP·Filed 2021·Granted Aug 26, 2025·0 cites·5 claims
- 0351US10490437B2Susceptor, vapor deposition apparatus, vapor deposition method and epitaxial silicon waferSUMCO CORP·Filed 2016·Granted Nov 26, 2019·1 cites·4 claims
- 0433US2023230875A1Support substrate for bonded waferSUMCO CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →