Inventor · disambiguated record
David Hockanson
Also filed as: HOCKANSON DAVID · HOCKANSON DAVID M
8 granted patents·1 pending application·139 citations·filing 2001–2011
87Inventor score
Top patents by PatentIndex Score
9 records- 0187US7411283B2Interconnect design for reducing radiated emissionsSUN MICROSYSTEMS INC·Filed 2006·Granted Aug 12, 2008·24 cites·20 claims
- 0278US7265993B1Dispersive interconnect system for EMI reductionSUN MICROSYSTEMS INC·Filed 2005·Granted Sep 4, 2007·14 cites·22 claims
- 0378US6956285B2EMI grounding pins for CPU/ASIC chipsSUN MICROSYSTEMS INC·Filed 2003·Granted Oct 18, 2005·29 cites·38 claims
- 0477US6573590B1Integrated circuit package with EMI containment featuresSUN MICROSYSTEMS INC·Filed 2002·Granted Jun 3, 2003·29 cites·18 claims
- 0576US6944025B2EMI shielding apparatusSUN MICROSYSTEMS INC·Filed 2003·Granted Sep 13, 2005·26 cites·17 claims
- 0670US6850878B2System and method for determining the required decoupling capacitors for a power distribution system using an improved capacitor modelSUN MICROSYSTEMS INC·Filed 2001·Granted Feb 1, 2005·17 cites·40 claims
- 0751US7969712B2Power integrity circuits with EMI benefitsORACLE AMERICA INC·Filed 2007·Granted Jun 28, 2011·0 cites·1 claims
- 0845US8514549B2Power integrity circuits with EMI benefitsHOCKANSON DAVID·Filed 2011·Granted Aug 20, 2013·0 cites·8 claims
- 0935US2004062020A1EMI shield for an integrated circuitFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →