Inventor · disambiguated record
Daniel Hölzl
Also filed as: HÖLZL DANIEL
2 granted patents·2 pending applications·0 citations·filing 2018–2024
27Inventor score
Top patents by PatentIndex Score
4 records- 0163US10658497B2Method for manufacturing semiconductor devices with superjunction structuresINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2018·Granted May 19, 2020·0 cites·25 claims
- 0258US10957788B2Semiconductor devices with superjunction structuresINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted Mar 23, 2021·0 cites·19 claims
- 0354US2024304528A1Power transistor chip packageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 0451US2023230903A1Semiconductor chip, chip system, method of forming a semiconductor chip, and method of forming a chip systemINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →