Inventor · disambiguated record
David A. Horine
Also filed as: HORINE DAVID A · HORINE DAVID ALBERT
24 granted patents·1,540 citations·filing 1992–2001
97Inventor score
Top patents by PatentIndex Score
24 records- 0198US5334804AWire interconnect structures for connecting an integrated circuit to a substrateFUJITSU LTD·Filed 1992·Granted Aug 2, 1994·280 cites·25 claims
- 0295US5773889AWire interconnect structures for connecting an integrated circuit to a substrateFUJITSU LTD·Filed 1996·Granted Jun 30, 1998·162 cites·20 claims
- 0394US6503454B1Multi-ejector system for ejecting biofluidsXEROX CORP·Filed 2000·Granted Jan 7, 2003·68 cites·16 claims
- 0493US5515604AMethods for making high-density/long-via laminated connectorsFUJITSU LTD·Filed 1993·Granted May 14, 1996·91 cites·29 claims
- 0592US5514906AApparatus for cooling semiconductor chips in multichip modulesFUJITSU LTD·Filed 1993·Granted May 7, 1996·158 cites·40 claims
- 0692US5426563AThree-dimensional multichip moduleFUJITSU LTD·Filed 1993·Granted Jun 20, 1995·127 cites·28 claims
- 0790US6514704B2Quality control mechanism and process for a biofluid multi-ejector systemXEROX CORP·Filed 2001·Granted Feb 4, 2003·43 cites·12 claims
- 0890US5655290AMethod for making a three-dimensional multichip moduleFUJITSU LTD·Filed 1995·Granted Aug 12, 1997·105 cites·7 claims
- 0989US5722162AFabrication procedure for a stable postFUJITSU LTD·Filed 1995·Granted Mar 3, 1998·97 cites·16 claims
- 1089US5536362AWire interconnect structures for connecting an integrated circuit to a substrateFUJITSU LTD·Filed 1994·Granted Jul 16, 1996·85 cites·25 claims
- 1187US6623700B1Level sense and control system for biofluid drop ejection devicesXEROX CORP·Filed 2000·Granted Sep 23, 2003·35 cites·22 claims
- 1282US6740530B1Testing method and configurations for multi-ejector systemXEROX CORP·Filed 2000·Granted May 25, 2004·18 cites·14 claims
- 1382US6713022B1Devices for biofluid drop ejectionXEROX CORP·Filed 2000·Granted Mar 30, 2004·21 cites·20 claims
- 1478US6034332APower supply distribution structure for integrated circuit chip modulesFUJITSU LTD·Filed 1998·Granted Mar 7, 2000·47 cites·13 claims
- 1577US6861034B1Priming mechanisms for drop ejection devicesXEROX CORP·Filed 2000·Granted Mar 1, 2005·25 cites·16 claims
- 1675US6350405B2Apparatus for manufacturing three dimensional parts using an inert gasXEROX CORP·Filed 2001·Granted Feb 26, 2002·17 cites·1 claims
- 1771US6019814AMethod of manufacturing 3D parts using a sacrificial materialXEROX CORP·Filed 1997·Granted Feb 1, 2000·35 cites·8 claims
- 1871US6007183AAcoustic metal jet fabrication using an inert gasXEROX CORP·Filed 1997·Granted Dec 28, 1999·33 cites·2 claims
- 1969US5603892ASystem for maintaining a controlled atmosphere in an electronic circuit packageFUJITSU LTD·Filed 1994·Granted Feb 18, 1997·31 cites·33 claims
- 2058US5765279AMethods of manufacturing power supply distribution structures for multichip modulesFUJITSU LTD·Filed 1995·Granted Jun 16, 1998·20 cites·48 claims
- 2153US5374196AHigh-density/long-via laminated connectorFUJITSU LTD·Filed 1994·Granted Dec 20, 1994·16 cites·17 claims
- 2248US5930890AStructure and fabrication procedure for a stable postFUJITSU LTD·Filed 1997·Granted Aug 3, 1999·12 cites·10 claims
- 2341US6248151B1Method of manufacturing three dimensional parts using an inert gasXEROX CORP·Filed 1999·Granted Jun 19, 2001·7 cites·12 claims
- 2437US6168971B1Method of assembling thin film jumper connectors to a substrateFUJITSU LTD·Filed 1998·Granted Jan 2, 2001·7 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →