Inventor · disambiguated record
Daesup Hyun
Also filed as: HYUN DAESUP
0 granted patents·6 pending applications·0 citations·filing 2009–2018
Top patents by PatentIndex Score
6 records- 0149US2018127552A1Method Of Forming A Gel Having Improved Thermal StabilityDOW CORNING·Filed 2018·Application pending·0 cites
- 0248US2014287247A1Method of Forming a Gel Having Improved Thermal StabilityDOW CORNING·Filed 2012·Application pending·0 cites
- 0342US2015017403A1Curable and patternable inks and method of printingDOW CORNING KOREA LTD·Filed 2013·Application pending·0 cites
- 0441US2011224344A1Liquid Die Bonding AgentFUJISAWA TOYOHIKO·Filed 2009·Application pending·0 cites
- 0540US2014291872A1Gel Having Improved Thermal StabilityDOW CORNING·Filed 2012·Application pending·0 cites
- 0635US2015130086A1Gel Having Improved Thermal StabilityDOW COMING CORP·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →