Inventor · disambiguated record
Daniel Kappauf
Also filed as: KAPPAUF DANIEL
3 granted patents·1 pending application·0 citations·filing 2019–2022
40Inventor score
Files withSIEMENS AG4
Top patents by PatentIndex Score
4 records- 0154US12444671B2Semiconductor component with damped bonding surfaces in a package with encapsulated pinsSIEMENS AG·Filed 2022·Granted Oct 14, 2025·0 cites·20 claims
- 0248US11832425B2Support for electric componentsSIEMENS AG·Filed 2020·Granted Nov 28, 2023·0 cites·18 claims
- 0343US11915990B2Method for manufacturing a power module unitSIEMENS AG·Filed 2021·Granted Feb 27, 2024·0 cites·14 claims
- 0427US2022059426A1Method for producing a power module unit, power module unit, network part and frequency converterSIEMENS AG·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →