Inventor · disambiguated record
Daniel Daeik Kim
Also filed as: KIM DANIEL DAEIK
15 granted patents·4 pending applications·8 citations·filing 2016–2022
85Inventor score
Top patents by PatentIndex Score
19 records- 0189US11515247B2Capacitance fine tuning by fin capacitor designQUALCOMM INC·Filed 2021·Granted Nov 29, 2022·2 cites·20 claims
- 0281US11011461B2Perpendicular inductors integrated in a substrateQUALCOMM INC·Filed 2019·Granted May 18, 2021·4 cites·15 claims
- 0377US11770115B2Tunable circuit including integrated filter circuit coupled to variable capacitance, and related integrated circuit (IC) packages and fabrication methodsQUALCOMM INC·Filed 2021·Granted Sep 26, 2023·1 cites·18 claims
- 0477US11658403B2Device, package and/or substrate comprising curved antennaQUALCOMM INC·Filed 2020·Granted May 23, 2023·1 cites·37 claims
- 0561US10903240B2Integrated circuits (ICs) on a glass substrateQUALCOMM INC·Filed 2019·Granted Jan 26, 2021·0 cites·15 claims
- 0658US11239158B1Wire bond inductor structures for flip chip diesQUALCOMM INC·Filed 2020·Granted Feb 1, 2022·0 cites·20 claims
- 0756US12009292B2Metal-insulator-metal (MIM) capacitor structure for layer count reduction and lower capacitance variationQUALCOMM INC·Filed 2021·Granted Jun 11, 2024·0 cites·18 claims
- 0854US12016247B2Package comprising an integrated passive device configured as a cap for a filterQUALCOMM INC·Filed 2020·Granted Jun 18, 2024·0 cites·22 claims
- 0953US11728293B2Chip modules employing conductive pillars to couple a passive component device to conductive traces in a metallization structure to form a passive componentQUALCOMM INC·Filed 2021·Granted Aug 15, 2023·0 cites·14 claims
- 1052US12402332B2Integrated passive devicesRF360 SINGAPORE PTE LTD·Filed 2021·Granted Aug 26, 2025·0 cites·39 claims
- 1151US11502652B2Substrate comprising capacitor configured for power amplifier output matchQUALCOMM INC·Filed 2020·Granted Nov 15, 2022·0 cites·27 claims
- 1251US2023352423A1Die edge protection to eliminate die chippingQUALCOMM INC·Filed 2022·Application pending·0 cites
- 1348US11380471B2RF damping structure in inductive deviceQUALCOMM INC·Filed 2018·Granted Jul 5, 2022·0 cites·17 claims
- 1447US11817239B2Embedded vertical inductor in laminate stacked substratesQUALCOMM INC·Filed 2018·Granted Nov 14, 2023·0 cites·14 claims
- 1547US10879191B2Conformal shielding for solder ball arrayQUALCOMM INC·Filed 2019·Granted Dec 29, 2020·0 cites·19 claims
- 1646US2022248541A1System in package (sip) socket connector interfaceQUALCOMM INC·Filed 2021·Application pending·0 cites
- 1745US2021375732A1Partial component embedding in a substrateQUALCOMM INC·Filed 2020·Application pending·0 cites
- 1840US2021249177A1Shielding for a laminate inductor coilQUALCOMM INC·Filed 2020·Application pending·0 cites
- 1938US10319694B2Semiconductor assembly and method of making sameQUALCOMM INC·Filed 2016·Granted Jun 11, 2019·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →