Inventor · disambiguated record
Dae-Woo Kim
Also filed as: KIM DAE S · KIM DAE-WOO
71 granted patents·29 pending applications·244 citations·filing 1996–2025
98Inventor score
Top patents by PatentIndex Score
100 records- 0199US10177083B2Alternative surfaces for conductive pad layers of silicon bridges for semiconductor packagesINTEL CORP·Filed 2015·Granted Jan 8, 2019·39 cites·25 claims
- 0298US11626372B2Metal-free frame design for silicon bridges for semiconductor packagesINTEL CORP·Filed 2021·Granted Apr 11, 2023·4 cites·18 claims
- 0396US10916514B2Metal-free frame design for silicon bridges for semiconductor packagesINTEL CORP·Filed 2019·Granted Feb 9, 2021·9 cites·20 claims
- 0496US8933451B2Organinc light emitting display device and method of manufacturing the sameKIM DAE-WOO·Filed 2011·Granted Jan 13, 2015·20 cites·13 claims
- 0593US8809863B2Thin-film transistor array substrate, organic light-emitting display having the same, and method of manufacturing the organic light-emitting displayKIM DAE-WOO·Filed 2011·Granted Aug 19, 2014·11 cites·11 claims
- 0693US8164252B2Organic light emitting diode display apparatus and method of manufacturing the sameLEE DAE-WOO·Filed 2009·Granted Apr 24, 2012·15 cites·9 claims
- 0791US11776916B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 3, 2023·2 cites·20 claims
- 0890US10461047B2Metal-free frame design for silicon bridges for semiconductor packagesINTEL CORP·Filed 2015·Granted Oct 29, 2019·5 cites·25 claims
- 0990US10170525B2Organic light emitting display deviceSAMSUNG DISPLAY CO LTD·Filed 2016·Granted Jan 1, 2019·7 cites·16 claims
- 1089US12331373B2Steel material, for pressure vessel, showing excellent hydrogen-induced cracking resistance and method for preparing samePOSCO·Filed 2018·Granted Jun 17, 2025·2 cites·5 claims
- 1189US11634785B2Steel material showing excellent hydrogen-induced cracking resistance and method for preparing samePOSCO·Filed 2018·Granted Apr 25, 2023·1 cites·4 claims
- 1289US11380643B2Rounded metal trace corner for stress reductionINTEL CORP·Filed 2020·Granted Jul 5, 2022·2 cites·20 claims
- 1389US2025070056A1Metal-free frame design for silicon bridges for semiconductor packagesINTEL CORP·Filed 2024·Application pending·0 cites
- 1487US2025029908A1Guard ring design enabling in-line testing of silicon bridges for semiconductor packagesINTEL CORP·Filed 2024·Application pending·0 cites
- 1586US11282792B2Semiconductor package having dummy pads and method of manufacturing semiconductor package having dummy padsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 22, 2022·2 cites·20 claims
- 1686US9553138B2Organic light-emitting diode display having a repair lineSAMSUNG DISPLAY CO LTD·Filed 2015·Granted Jan 24, 2017·5 cites·19 claims
- 1786US9542522B2Interconnect routing configurations and associated techniquesINTEL CORP·Filed 2014·Granted Jan 10, 2017·6 cites·15 claims
- 1885US12243812B2Alternative surfaces for conductive pad layers of silicon bridges for semiconductor packagesINTEL CORP·Filed 2023·Granted Mar 4, 2025·0 cites·16 claims
- 1985US7641546B2Cooling apparatus and method for controlling the sameLG ELECTRONICS INC·Filed 2006·Granted Jan 5, 2010·25 cites·10 claims
- 2083US8378352B2Organic light-emitting display device and manufacturing method of the sameSAMSUNG DISPLAY CO LTD·Filed 2011·Granted Feb 19, 2013·9 cites·25 claims
- 2183US7648245B2Cooling system of thin projector and method for controlling the sameLG ELECTRONICS INC·Filed 2006·Granted Jan 19, 2010·9 cites·21 claims
- 2282US12170253B2Metal-free frame design for silicon bridges for semiconductor packagesINTEL CORP·Filed 2023·Granted Dec 17, 2024·0 cites·20 claims
- 2382US12142553B2Guard ring design enabling in-line testing of silicon bridges for semiconductor packagesINTEL CORP·Filed 2023·Granted Nov 12, 2024·0 cites·20 claims
- 2482US12074121B2Metal-free frame design for silicon bridges for semiconductor packagesINTEL CORP·Filed 2023·Granted Aug 27, 2024·0 cites·20 claims
- 2581US9153605B2Thin film transistor array substrate, organic light emitting display device comprising the same, and method of manufacturing the thin film transistor array substrateKIM DAE-WOO·Filed 2012·Granted Oct 6, 2015·6 cites·20 claims
- 2680US12261164B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Mar 25, 2025·0 cites·20 claims
- 2780US12237308B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Feb 25, 2025·0 cites·20 claims
- 2879US9136506B2Thin-film transistor array substrate, organic light-emitting display having the same, and method of manufacturing the organic light-emitting displaySAMSUNG DISPLAY CO LTD·Filed 2014·Granted Sep 15, 2015·3 cites·9 claims
- 2979US8610884B2Method for optical visualization of graphene domainsJUNG HEE TAE·Filed 2012·Granted Dec 17, 2013·3 cites·10 claims
- 3079US7700898B2Heat treatment equipment and method of driving the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Apr 20, 2010·11 cites·16 claims
- 3178US10604817B2High-strength steel plate for pressure vessel having excellent toughness after post weld heat treatment and manufacturing method thereofPOSCO·Filed 2015·Granted Mar 31, 2020·1 cites·4 claims
- 3278US7943481B1Method of forming fine patternsHYNIX SEMICONDUCTOR INC·Filed 2010·Granted May 17, 2011·4 cites·16 claims
- 3378US2025192017A1Alternative surfaces for conductive pad layers of silicon bridges for semiconductor packagesINTEL CORP·Filed 2025·Application pending·0 cites
- 3477US11676889B2Guard ring design enabling in-line testing of silicon bridges for semiconductor packagesINTEL CORP·Filed 2022·Granted Jun 13, 2023·0 cites·21 claims
- 3577US10797014B2Rounded metal trace corner for stress reductionINTEL CORP·Filed 2016·Granted Oct 6, 2020·2 cites·11 claims
- 3675US2025183246A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 3774US11784150B2Rounded metal trace corner for stress reductionINTEL CORP·Filed 2022·Granted Oct 10, 2023·0 cites·20 claims
- 3873US12134800B2Highly thick steel material having excellent low-temperature impact toughness and manufacturing method thereforPOSCO CO LTD·Filed 2021·Granted Nov 5, 2024·0 cites·10 claims
- 3973US2025364491A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 4072US12227826B2Steel plate for pressure vessel having excellent hydrogen induced cracking resistance and method of manufacturing samePOSCO·Filed 2019·Granted Feb 18, 2025·0 cites·4 claims
- 4172US2025376747A1Extremely thick steel material for flange having excellent strength and low temperature impact toughness, and manufacturing method for samePOSCO CO LTD·Filed 2023·Application pending·0 cites
- 4271US11798929B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 24, 2023·0 cites·20 claims
- 4370US10418312B2Guard ring design enabling in-line testing of silicon bridges for semiconductor packagesINTEL CORP·Filed 2015·Granted Sep 17, 2019·1 cites·26 claims
- 4470US10356293B2Image sensor having outer and inner address markersSK HYNIX INC·Filed 2016·Granted Jul 16, 2019·2 cites·13 claims
- 4570US2023395523A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4669US11901336B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 13, 2024·0 cites·20 claims
- 4769US10400685B2Apparatus and method for correction of intake pulsationHYUNDAI MOTOR CO LTD·Filed 2017·Granted Sep 3, 2019·1 cites·18 claims
- 4869US2024410030A1Ultrathick steel materials for flange having excellent strength and low temperature impact toughness, and manufacturing method thereforPOSCO CO LTD·Filed 2022·Application pending·0 cites
- 4968US9136313B2Organic light-emitting display apparatus and method for manufacturing the sameSAMSUNG DISPLAY CO LTD·Filed 2014·Granted Sep 15, 2015·1 cites·20 claims
- 5068US7936382B2Image pickup device, projector including the image pickup device, and image pickup methodLG ELECTRONICS INC·Filed 2007·Granted May 3, 2011·2 cites·6 claims
Showing the top 50 of 100 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →