Inventor · disambiguated record
Daniel N. Koury, Jr.
Also filed as: KOURY DANIEL N · KOURY JR DANIEL · KOURY JR DANIEL N · KOURY JR DANIEL NICOLAS
26 granted patents·2 pending applications·571 citations·filing 1984–2014
97Inventor score
Top patents by PatentIndex Score
28 records- 0198US6845670B1Single proof mass, 3 axis MEMS transducerFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Jan 25, 2005·127 cites·46 claims
- 0297US7829366B2Microelectromechanical systems component and method of making sameFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Nov 9, 2010·43 cites·10 claims
- 0396US8477473B1Transducer structure and method for MEMS devicesKOURY JR DANIEL N·Filed 2010·Granted Jul 2, 2013·28 cites·20 claims
- 0494US6936492B2Single proof mass, 3 axis MEMS transducerFREESCALE SEMICONDUCTOR INC·Filed 2004·Granted Aug 30, 2005·48 cites·14 claims
- 0591US7268463B2Stress release mechanism in MEMS device and method of making sameFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Sep 11, 2007·25 cites·9 claims
- 0690US8710597B1Method and structure for adding mass with stress isolation to MEMS structuresKOURY JR DANIEL N·Filed 2011·Granted Apr 29, 2014·6 cites·10 claims
- 0790US8056415B2Semiconductor device with reduced sensitivity to package stressMCNEIL ANDREW C·Filed 2008·Granted Nov 15, 2011·22 cites·9 claims
- 0889US7637160B2MEMS suspension and anchoring designFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Dec 29, 2009·21 cites·18 claims
- 0986US8553389B1Anchor design and method for MEMS transducer apparatusesKOURY JR DANIEL N·Filed 2010·Granted Oct 8, 2013·5 cites·19 claims
- 1085US4647331AMethod for assembling an electro-optical deviceMOTOROLA INC·Filed 1984·Granted Mar 3, 1987·43 cites·8 claims
- 1183US7628072B2MEMS device and method of reducing stiction in a MEMS deviceFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Dec 8, 2009·12 cites·20 claims
- 1280US6465320B1Electronic component and method of manufacturingMOTOROLA INC·Filed 2000·Granted Oct 15, 2002·24 cites·26 claims
- 1378US9300227B2Monolithic body MEMS devicesSILICON LAB INC·Filed 2013·Granted Mar 29, 2016·2 cites·28 claims
- 1477US9376312B2Method for fabricating a transducer apparatusKOURY JR DANIEL N·Filed 2013·Granted Jun 28, 2016·2 cites·20 claims
- 1573US9377487B2Transducer structure and method for MEMS devicesMCUBE INC·Filed 2013·Granted Jun 28, 2016·2 cites·16 claims
- 1673US5806365AAcceleration sensing device on a support substrate and method of operationMOTOROLA INC·Filed 1996·Granted Sep 15, 1998·33 cites·20 claims
- 1770US9321629B2Method and structure for adding mass with stress isolation to MEMS structuresMCUBE INC·Filed 2014·Granted Apr 26, 2016·0 cites·15 claims
- 1869US9246412B2Suspended passive element for MEMS devicesSILICON LAB INC·Filed 2013·Granted Jan 26, 2016·1 cites·21 claims
- 1967US6018998AAcceleration sensing device and method of operation and formingMOTOROLA INC·Filed 1998·Granted Feb 1, 2000·26 cites·9 claims
- 2067US4876212AProcess for fabricating complimentary semiconductor devices having pedestal structuresMOTOROLA INC·Filed 1987·Granted Oct 24, 1989·24 cites·24 claims
- 2165US8564075B1Package tolerate design and methodKOURY JR DANIEL N·Filed 2011·Granted Oct 22, 2013·2 cites·9 claims
- 2263US4757029AMethod of making vertical field effect transistor with plurality of gate input cnnectionsMOTOROLA INC·Filed 1987·Granted Jul 12, 1988·20 cites·7 claims
- 2362US9602026B2Temperature compensation for MEMS devicesSILICON LAB INC·Filed 2013·Granted Mar 21, 2017·1 cites·10 claims
- 2462US6122963AElectronic component for measuring accelerationMOTOROLA INC·Filed 1999·Granted Sep 26, 2000·22 cites·17 claims
- 2557US6228275B1Method of manufacturing a sensorMOTOROLA INC·Filed 1998·Granted May 8, 2001·17 cites·17 claims
- 2654US5914521ASensor devices having a movable structureMOTOROLA INC·Filed 1997·Granted Jun 22, 1999·15 cites·17 claims
- 2740US2010301706A1Differential piezoelectric sensorFREESCALE SEMICONDUCTOR INC·Filed 2009·Application pending·0 cites
- 2840US2008290430A1Stress-Isolated MEMS Device and Method ThereforFREESCALE SEMICONDUCTOR INC·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →