Inventor · disambiguated record
Daeho Lee
Also filed as: LEE DAEHO
16 granted patents·24 pending applications·6 citations·filing 2014–2025
86Inventor score
Files withSAMSUNG DISPLAY CO LTD18SAMSUNG ELECTRONICS CO LTD18GACHON UNIV OF INDUSTRY-ACADEMIC COOP FOUND1LEE DAEHO1UNIV CALIFORNIA1
Top patents by PatentIndex Score
40 records- 0192US12327824B2Semiconductor package including redistribution substrateSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 10, 2025·2 cites·20 claims
- 0291US12062647B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 13, 2024·2 cites·20 claims
- 0378US2025125317A1Semiconductor package and stacked package module including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0477US12133404B2Organic light-emitting diode and method of manufacturing the sameSAMSUNG DISPLAY CO LTD·Filed 2023·Granted Oct 29, 2024·0 cites·10 claims
- 0576US12176328B2Semiconductor package and stacked package module including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 24, 2024·0 cites·20 claims
- 0674US12237319B2Stacked-chip packagesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Feb 25, 2025·0 cites·20 claims
- 0774US10999934B2Metal oxide nanoparticle ink composition, method of producing same, and method of forming conductive layer pattern using sameUNIV GACHON IND ACAD COOP FOUND·Filed 2019·Granted May 4, 2021·1 cites·4 claims
- 0874US2024355796A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0974US2025006714A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1070US2025259975A1Semiconductor package including redistribution substrateSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1169US10818652B2Display device and manufacturing method thereofSAMSUNG DISPLAY CO LTD·Filed 2017·Granted Oct 27, 2020·1 cites·37 claims
- 1267US11825675B2Organic light-emitting diode including a hole injection layer, and method of manufacturing the sameSAMSUNG DISPLAY CO LTD·Filed 2021·Granted Nov 21, 2023·0 cites·10 claims
- 1367US11769762B2Semiconductor package and stacked package module including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 26, 2023·0 cites·20 claims
- 1466US11923351B2Stacked-chip packages having through viasSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 5, 2024·0 cites·20 claims
- 1565US2024206329A1Compound, organic photodetector including the compound, and electronic apparatus including the organic photodetectorSAMSUNG DISPLAY CO LTD·Filed 2023·Application pending·0 cites
- 1663US12215066B2Organic photodetector and electronic device including the sameSAMSUNG DISPLAY CO LTD·Filed 2022·Granted Feb 4, 2025·0 cites·20 claims
- 1762US2025081789A1Display apparatusSAMSUNG DISPLAY CO LTD·Filed 2024·Application pending·0 cites
- 1860US12514101B2Electronic deviceSAMSUNG DISPLAY CO LTD·Filed 2022·Granted Dec 30, 2025·0 cites·20 claims
- 1960US2024349601A1Organic photodetector including condensed cyclic compound, electronic apparatus including the organic photodetector, and the condensed cyclic compoundSAMSUNG DISPLAY CO LTD·Filed 2024·Application pending·0 cites
- 2059US2025311505A1Display apparatus, method of manufacturing the same, and electronic apparatus including the sameSAMSUNG DISPLAY CO LTD·Filed 2025·Application pending·0 cites
- 2158US2025374777A1Display apparatusSAMSUNG DISPLAY CO LTD·Filed 2025·Application pending·0 cites
- 2258US2022399513A1Organic photodetector and electronic device having the sameSAMSUNG DISPLAY CO LTD·Filed 2022·Application pending·0 cites
- 2358US2023157125A1Light receiving element and electronic device including the sameSAMSUNG DISPLAY CO LTD·Filed 2022·Application pending·0 cites
- 2456US12495633B2Semiconductor package including stack structure of logic chip and sensing chipsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 9, 2025·0 cites·15 claims
- 2556US11706937B2Organic light-emitting deviceSAMSUNG DISPLAY CO LTD·Filed 2020·Granted Jul 18, 2023·0 cites·20 claims
- 2656US2025062304A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2754US2023200097A1Organic photodetector and electronic apparatus including the sameSAMSUNG DISPLAY CO LTD·Filed 2022·Application pending·0 cites
- 2853US2024055394A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2952US2022033959A1Crucible apparatus and deposition apparatus including the sameSAMSUNG DISPLAY CO LTD·Filed 2021·Application pending·0 cites
- 3051US12501158B2Method of image stabilization and electronic device performing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 16, 2025·0 cites·18 claims
- 3150US2022173343A1Light-emitting device and an electronic apparatus including the sameSAMSUNG DISPLAY CO LTD·Filed 2021·Application pending·0 cites
- 3247US12444164B2Image sensor including internal pre-processor configured to generate a merged image, image processing system including the same, and image processing methodSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 14, 2025·0 cites·20 claims
- 3347US2024257310A1Image processor and image processing system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3446US2021217964A1Organic light-emitting deviceSAMSUNG DISPLAY CO LTD·Filed 2021·Application pending·0 cites
- 3546US2015064057A1Methods for producing nio nanoparticle thin films and patterning of ni conductors by nio reductive sintering and laser ablationUNIV CALIFORNIA·Filed 2014·Application pending·0 cites
- 3643US2019204496A1Backlight unit and display device including the sameSAMSUNG DISPLAY CO LTD·Filed 2019·Application pending·0 cites
- 3742US2025239577A1Chip structure including optical integrated circuit chip, and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 3835US2020383601A1Method for providing guide information associated with artifacts and magnetic resonance imaging device thereforSAMSUNG ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 3928US2016056127A1Semiconductor packageLEE DAEHO·Filed 2015·Application pending·0 cites
- 4028US2017149004A1Method for manufacturing thin film including nickel oxide nanoparticle and solar cell having the sameGACHON UNIV OF INDUSTRY-ACADEMIC COOP FOUND·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →