Inventor · disambiguated record
Date-Gun Lee
Also filed as: LEE DATE G · LEE DATE GUN
6 granted patents·1 pending application·20 citations·filing 2003–2005
77Inventor score
Top patents by PatentIndex Score
7 records- 0162US7307015B2Method for forming an interconnection line in a semiconductor deviceDONGBU ELECTRONICS CO LTD·Filed 2005·Granted Dec 11, 2007·3 cites·15 claims
- 0251US6995082B2Bonding pad of a semiconductor device and formation method thereofDONGBUANAM SEMICONDUCTOR INC·Filed 2003·Granted Feb 7, 2006·6 cites·19 claims
- 0347US7186644B2Methods for preventing copper oxidation in a dual damascene processDONGBU ELECTRONICS CO LTD·Filed 2004·Granted Mar 6, 2007·4 cites·7 claims
- 0447US6972242B2Methods to fabricate semiconductor devicesDONGBUANAM SEMICONDUCTOR INC·Filed 2003·Granted Dec 6, 2005·4 cites·6 claims
- 0545US7271091B2Method for forming metal pattern to reduce contact resistivity with interconnection contactDONGBU ELECTRONICS CO LTD·Filed 2004·Granted Sep 18, 2007·3 cites·6 claims
- 0636US7183218B2Methods for fabricating a semiconductor device with etch end point detectionDONGBU ELECTRONICS CO LTD·Filed 2003·Granted Feb 27, 2007·0 cites·11 claims
- 0736US2005142886A1Method for forming a contact in semiconductor deviceDONGBUANAM SEMICONDUCTOR INC·Filed 2004·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Date-Gun Lee files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →