Inventor · disambiguated record
Dangyuan Lei
Also filed as: LEI DANGYUAN
1 granted patent·4 pending applications·0 citations·filing 2020–2023
8Inventor score
Top patents by PatentIndex Score
5 records- 0157US12031754B2Coating with smart sub-ambient radiative coolingUNIV HONG KONG POLYTECHNIC·Filed 2020·Granted Jul 9, 2024·0 cites·19 claims
- 0256US2024182727A1Coating composition, its preparation and use in reducing heat gainUNIV CITY HONG KONG·Filed 2022·Application pending·0 cites
- 0349US2024040750A1Radiative cooling interface for wearable electronic deviceUNIV CITY HONG KONG·Filed 2023·Application pending·0 cites
- 0447US2025199472A1Phase change material-based metasurface structure and related methodUNIV CITY HONG KONG·Filed 2023·Application pending·0 cites
- 0546US2024168437A1Metasurface structure and related article and methodUNIV CITY HONG KONG·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →