Inventor · disambiguated record
Daniel Wayne Levesque, Jr.
Also filed as: LEVESQUE DANIEL · LEVESQUE JR DANIEL WAYNE
13 granted patents·8 pending applications·547 citations·filing 1993–2024
92Inventor score
Files withCORNING INC12CA NAT RESEARCH COUNCIL5AMERICAN IRON AND STEEL INST1PYROTEK INC1ROUILLARD CLAUDE1
Top patents by PatentIndex Score
21 records- 0195US6057927ALaser-ultrasound spectroscopy apparatus and method with detection of shear resonances for measuring anisotropy, thickness, and other propertiesAMERICAN IRON AND STEEL INST·Filed 1998·Granted May 2, 2000·279 cites·45 claims
- 0294US7353709B2Method and system for determining material properties using ultrasonic attenuationCA NAT RESEARCH COUNCIL·Filed 2005·Granted Apr 8, 2008·41 cites·25 claims
- 0388US6128092AMethod and system for high resolution ultrasonic imaging of small defects or anomalies.CA NAT RESEARCH COUNCIL·Filed 1999·Granted Oct 3, 2000·97 cites·34 claims
- 0484US6532821B2Apparatus and method for evaluating the physical properties of a sample using ultrasonicsCA NAT RESEARCH COUNCIL·Filed 2001·Granted Mar 18, 2003·30 cites·33 claims
- 0582US6397680B1Ultrasonic spectroscopy apparatus for determining thickness and other properties of multilayer structuresCA NAT RESEARCH COUNCIL·Filed 2000·Granted Jun 4, 2002·44 cites·29 claims
- 0680US10134657B2Inorganic wafer having through-holes attached to semiconductor waferCORNING INC·Filed 2017·Granted Nov 20, 2018·2 cites·20 claims
- 0779US10077206B2Methods of etching glass substrates and glass substratesCORNING INC·Filed 2016·Granted Sep 18, 2018·4 cites·15 claims
- 0876US10366904B2Articles having holes with morphology attributes and methods for fabricating the sameCORNING INC·Filed 2017·Granted Jul 30, 2019·3 cites·29 claims
- 0975US11608291B2Micro-perforated panel systems, applications, and methods of making micro-perforated panel systemsCORNING INC·Filed 2017·Granted Mar 21, 2023·1 cites·20 claims
- 1074US10424606B1Systems and methods for reducing substrate surface disruption during via formationCORNING INC·Filed 2018·Granted Sep 24, 2019·2 cites·55 claims
- 1174US5408881AHigh resolution ultrasonic interferometry for quantitative mondestructive characterization of interfacial adhesion in multilayer compositesCA NAT RESEARCH COUNCIL·Filed 1993·Granted Apr 25, 1995·43 cites·5 claims
- 1271US7988763B2Use of a binary salt flux of NaCl and MgCl2 for the purification of aluminium or aluminium alloys, and method thereofPYROTEK INC·Filed 2009·Granted Aug 2, 2011·1 cites·34 claims
- 1360US10756003B2Inorganic wafer having through-holes attached to semiconductor waferCORNING INC·Filed 2018·Granted Aug 25, 2020·0 cites·13 claims
- 1460US2025157812A1Methods for forming through-glass viasCORNING INC·Filed 2024·Application pending·0 cites
- 1556US2024351945A1Glass ceramic substrate with through-glass viaCORNING INC·Filed 2022·Application pending·0 cites
- 1648US2023402337A13d interposer with through glass vias - method of increasing adhesion between copper and glass surfaces and articles therefromCORNING INC·Filed 2021·Application pending·0 cites
- 1747US2019119150A1Methods for laser processing transparent workpieces using pulsed laser beam focal lines and chemical etching solutionsCORNING INC·Filed 2018·Application pending·0 cites
- 1845US2023341986A1Systems and methods for forming wrap around electrodesCORNING INC·Filed 2020·Application pending·0 cites
- 1943US2018105455A1Silica test probe and other such devicesCORNING INC·Filed 2017·Application pending·0 cites
- 2041US2010298434A1Neuroprotection and prevention of dopaminergic cell death by targeting nur77 translocationROUILLARD CLAUDE·Filed 2010·Application pending·0 cites
- 2140US2012017726A1Use of a tertiary salt flux of nacl, kci and mgcl2 for the purification of aluminium or aluminium alloys, and method thereofTREMBLAY SYLVAIN·Filed 2011·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Daniel Wayne Levesque, Jr. files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →