Inventor · disambiguated record
David J. Lewison
Also filed as: LEWISON DAVID J
9 granted patents·29 citations·filing 2015–2021
80Inventor score
Files withIBM9
Top patents by PatentIndex Score
9 records- 0195US10842043B1Fabricating coolant-cooled heat sinks with internal thermally-conductive finsIBM·Filed 2019·Granted Nov 17, 2020·22 cites·20 claims
- 0294US11156409B2Coolant-cooled heat sinks with internal thermally-conductive fins joined to the coverIBM·Filed 2020·Granted Oct 26, 2021·6 cites·20 claims
- 0377US11158562B2Conformal integrated circuit (IC) device package lidIBM·Filed 2020·Granted Oct 26, 2021·1 cites·19 claims
- 0460US12005148B2Coolant-cooled heat sink(s) with associated ultra-violet light assemblyIBM·Filed 2021·Granted Jun 11, 2024·0 cites·17 claims
- 0559US11940271B2High power device fault localization via die surface contouringIBM·Filed 2020·Granted Mar 26, 2024·0 cites·20 claims
- 0654US11430710B2Lid/heat spreader having targeted flexibilityIBM·Filed 2020·Granted Aug 30, 2022·0 cites·20 claims
- 0749US11614324B2Non-destructive bond line thickness measurement of thermal interface material on silicon packagesIBM·Filed 2019·Granted Mar 28, 2023·0 cites·12 claims
- 0848US11716808B2Tamper-respondent assemblies with porous heat transfer element(s)IBM·Filed 2020·Granted Aug 1, 2023·0 cites·18 claims
- 0939US9673177B1Selectively soluble standoffs for chip joiningIBM·Filed 2015·Granted Jun 6, 2017·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →