Inventor · disambiguated record
Danfeng Li
Also filed as: LI DANFENG
1 granted patent·4 pending applications·1 citations·filing 2020–2024
17Inventor score
Files withBOSTIK SA5
Top patents by PatentIndex Score
5 records- 0177US12359105B2Low tack hot-melt pressure sensitive adhesivesBOSTIK SA·Filed 2020·Granted Jul 15, 2025·1 cites·17 claims
- 0263US2025388790A1Hot melt adhesive compositionBOSTIK SA·Filed 2022·Application pending·0 cites
- 0359US2024301258A1Hot melt adhesive compositionBOSTIK SA·Filed 2024·Application pending·0 cites
- 0457US2024318047A1Hot melt adhesive composition which feels soft in a laminate, methods for using the same, and articles made therewithBOSTIK SA·Filed 2022·Application pending·0 cites
- 0553US2023323167A1Hot melt adhesive compositionBOSTIK SA·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →