Inventor · disambiguated record
David Lysacek
Also filed as: LYSACEK DAVID
3 granted patents·1 pending application·11 citations·filing 2006–2023
63Inventor score
Top patents by PatentIndex Score
4 records- 0167US10242929B1Method of forming a multilayer structure for reducing defects in semiconductor devices and structureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Mar 26, 2019·3 cites·20 claims
- 0264US8846500B2Method of forming a gettering structure having reduced warpage and gettering a semiconductor wafer therewithLYSACEK DAVID·Filed 2010·Granted Sep 30, 2014·5 cites·16 claims
- 0361US7737004B2Multilayer gettering structure for semiconductor device and methodSEMICONDUCTOR COMPONENTS IND·Filed 2006·Granted Jun 15, 2010·3 cites·20 claims
- 0444US2025149377A1Structure and method of forming low-cost thick soi waferSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →