Inventor · disambiguated record
Dandan Lyu
Also filed as: LYU DANDAN
3 granted patents·4 citations·filing 2020–2023
55Inventor score
Top patents by PatentIndex Score
3 records- 0192US11720726B1Systems and methods of simulating drop shock reliability of solder joints with a multi-scale modelANSYS INC·Filed 2020·Granted Aug 8, 2023·4 cites·16 claims
- 0272US12147741B1Systems and methods of simulating drop shock reliability of solder joints with a multi-scale modelANSYS INC·Filed 2023·Granted Nov 19, 2024·0 cites·20 claims
- 0350US12173915B2Air conditioner defrosting control method and device, and non-transitory storage medium and air conditionerGREE ELECTRIC APPLIANCES INC ZHUHAI·Filed 2021·Granted Dec 24, 2024·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →