Inventor · disambiguated record
Darryl J. Mckenney
Also filed as: MCKENNEY DARRYL · MCKENNEY DARRYL J
16 granted patents·4 pending applications·529 citations·filing 1987–2017
95Inventor score
Files withPARLEX CORP8MERCURY SYSTEMS INC3TELEDYNE IND3COMPAQ COMPUTER CORP2MERCURY COMP SYSTEMS INC2
Top patents by PatentIndex Score
20 records- 0190US4800461AMultilayer combined rigid and flex printed circuitsTELEDYNE IND·Filed 1987·Granted Jan 24, 1989·124 cites·13 claims
- 0289US9761972B2Radio frequency connector and assembly having micro-via radial interconnectMERCURY SYSTEMS INC·Filed 2016·Granted Sep 12, 2017·8 cites·21 claims
- 0389US9033750B2Electrical contactTYCO ELECTRONICS CORP·Filed 2013·Granted May 19, 2015·21 cites·16 claims
- 0488US5262594AMultilayer rigid-flex printed circuit boards for use in infrared reflow oven and method for assembling sameCOMPAQ COMPUTER CORP·Filed 1990·Granted Nov 16, 1993·103 cites·21 claims
- 0586US10096915B2Soldered interconnect for a printed circuit board having an angular radial featureMERCURY SYSTEMS INC·Filed 2017·Granted Oct 9, 2018·7 cites·4 claims
- 0686US5175047ARigid-flex printed circuitTELEDYNE IND·Filed 1991·Granted Dec 29, 1992·62 cites·3 claims
- 0785US6099745ARigid/flex printed circuit board and manufacturing method thereforPARLEX CORP·Filed 1999·Granted Aug 8, 2000·68 cites·10 claims
- 0875US5095628AProcess of forming a rigid-flex circuitTELEDYNE IND·Filed 1990·Granted Mar 17, 1992·45 cites·5 claims
- 0973US6689958B1Controlled impedance extruded flat ribbon cablePARLEX CORP·Filed 2002·Granted Feb 10, 2004·20 cites·15 claims
- 1073US5557843AMethod of making a circuit board or layer thereof including semi-curing a second adhesive coated on a cured first adhesivePARLEX CORP·Filed 1994·Granted Sep 24, 1996·31 cites·6 claims
- 1160US5362534AMultiple layer printed circuit boards and method of manufacturePARLEX CORP·Filed 1993·Granted Nov 8, 1994·19 cites·14 claims
- 1247US9128679B2Slot and memory module for a slot standing interconnectMCKENNEY DARRYL J·Filed 2012·Granted Sep 8, 2015·1 cites·16 claims
- 1344US6645549B1Process for providing bond enhancement and an etch resist in the fabrication of printed circuit boardsPARLEX CORP·Filed 2000·Granted Nov 11, 2003·3 cites·21 claims
- 1444US5178318AMultilayer rigid-flex printed circuit boards for use in infrared reflow oven and method for assembling sameCOMPAQ COMPUTER CORP·Filed 1991·Granted Jan 12, 1993·13 cites·4 claims
- 1543US9389654B2Air-flow-by cooling technology and air-flow-by circuit board modulesMERCURY COMP SYSTEMS INC·Filed 2013·Granted Jul 12, 2016·0 cites·4 claims
- 1640US2017149155A1Soldered interconnect for a printed circuit board having an angular radial featureMERCURY SYSTEMS INC·Filed 2015·Application pending·0 cites
- 1738US2008280463A1Rugged Chip PackagingMERCURY COMP SYSTEMS INC·Filed 2007·Application pending·0 cites
- 1836US2004011553A1Extruded flat cablePARLEX CORP·Filed 2002·Application pending·0 cites
- 1935US2004040148A1Manufacture of flexible printed circuit boardsPARLEX CORP·Filed 2002·Application pending·0 cites
- 2032US5376232AMethod of manufacturing a printed circuit boardPARLEX CORP·Filed 1993·Granted Dec 27, 1994·4 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →