Inventor · disambiguated record
Dale S. Mcpherson
Also filed as: MCPHERSON DALE · MCPHERSON DALE S
7 granted patents·11 pending applications·39 citations·filing 2003–2023
81Inventor score
Top patents by PatentIndex Score
18 records- 0193US7524427B2Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substratesMICROFABRICA INC·Filed 2005·Granted Apr 28, 2009·15 cites·3 claims
- 0284US7517462B2Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substratesMICROFABRICA INC·Filed 2005·Granted Apr 14, 2009·10 cites·13 claims
- 0376US10676836B2Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substratesMICROFABRICA INC·Filed 2018·Granted Jun 9, 2020·0 cites·27 claims
- 0475US9546431B2Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substratesMICROFABRICA INC·Filed 2014·Granted Jan 17, 2017·1 cites·16 claims
- 0574US2020354848A1Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric SubstratesMICROFABRICA INC·Filed 2020·Application pending·0 cites
- 0671US2017247807A1Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric SubstratesMICROFABRICA INC·Filed 2016·Application pending·0 cites
- 0765US7303663B2Multistep release method for electrochemically fabricated structuresMICROFABRICA INC·Filed 2003·Granted Dec 4, 2007·13 cites·11 claims
- 0862US2008105646A1Multi-step Release Method for Electrochemically Fabricated StructuresMICROFABRICA INC·Filed 2007·Application pending·0 cites
- 0959US8512578B2Multi-step release method for electrochemically fabricated structuresCOHEN ADAM L·Filed 2010·Granted Aug 20, 2013·0 cites·18 claims
- 1057US2008121343A1Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric SubstratesMICROFABRICA INC·Filed 2008·Application pending·0 cites
- 1156US12409068B2Patient interface devices and methods and systems for combined sonic and laser applicationsLENSAR INC·Filed 2021·Granted Sep 9, 2025·0 cites·21 claims
- 1254US2010270165A1Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric SubstratesMICROFABRICA INC·Filed 2010·Application pending·0 cites
- 1352US2024017990A1Methods of separating good probe structures from defective probe structures in an electrochemical fabrication systemMICROFABRICA INC·Filed 2023·Application pending·0 cites
- 1449US2005176238A1Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substratesMICROFABRICA INC·Filed 2005·Application pending·0 cites
- 1549US2005194258A1Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substratesMICROFABRICA INC·Filed 2005·Application pending·0 cites
- 1648US2005230261A1Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substratesCOHEN ADAM L·Filed 2005·Application pending·0 cites
- 1748US2005215046A1Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substratesCOHEN ADAM L·Filed 2005·Application pending·0 cites
- 1837US2005072681A1Multi-step release method for electrochemically fabricated structuresMICROFABRICA INC·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →