Inventor · disambiguated record
Daniel J. Miller
Also filed as: MILLER DANIEL J · MILLER DANIEL JEFFREY
12 granted patents·519 citations·filing 1987–2012
93Inventor score
Top patents by PatentIndex Score
12 records- 0190US5324569AComposite transversely plastic interconnect for microchip carrierHEWLETT PACKARD CO·Filed 1993·Granted Jun 28, 1994·119 cites·7 claims
- 0289US8330556B2Passivation layers in acoustic resonatorsMILLER DANIEL J·Filed 2009·Granted Dec 11, 2012·23 cites·16 claims
- 0387US5199165AHeat pipe-electrical interconnect integration method for chip modulesHEWLETT PACKARD CO·Filed 1992·Granted Apr 6, 1993·98 cites·5 claims
- 0484US5409157AComposite transversely plastic interconnect for microchip carrierFiled 1994·Granted Apr 25, 1995·79 cites·6 claims
- 0581US5426405AFamily of different-sized demountable hybrid assemblies with microwave-bandwidth interconnectsHEWLETT PACKARD CO·Filed 1994·Granted Jun 20, 1995·73 cites·16 claims
- 0674US5161090AHeat pipe-electrical interconnect integration for chip modulesHEWLETT PACKARD CO·Filed 1991·Granted Nov 3, 1992·53 cites·18 claims
- 0762US5221421AControlled etching process for forming fine-geometry circuit lines on a substrateHEWLETT PACKARD CO·Filed 1992·Granted Jun 22, 1993·35 cites·26 claims
- 0855US8881639B2Hybrid body armorMILLER DANIEL JEFFREY·Filed 2012·Granted Nov 11, 2014·2 cites·12 claims
- 0951US6732905B2Vented cavity, hermetic solder sealAGILENT TECHNOLOGIES INC·Filed 2002·Granted May 11, 2004·4 cites·13 claims
- 1050US6242075B1Planar multilayer ceramic structures with near surface channelsHEWLETT PACKARD CO·Filed 1998·Granted Jun 5, 2001·19 cites·20 claims
- 1149US5045526AMaking insulated superconductor wireHEWLETT PACKARD CO·Filed 1987·Granted Sep 3, 1991·12 cites·4 claims
- 1248US6958446B2Compliant and hermetic solder sealAGILENT TECHNOLOGIES INC·Filed 2002·Granted Oct 25, 2005·2 cites·12 claims
Join the waitlist — get patent alerts
Get an alert when Daniel J. Miller files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →