Inventor · disambiguated record
Daeho Min
Also filed as: MIN DAEHO
1 granted patent·3 pending applications·0 citations·filing 2021–2024
8Inventor score
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4 records- 0151US2025132185A1Cooling system for semiconductor equipmentSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0249US2024186282A1Die bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0346US12112970B2Substrate transfer apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 8, 2024·0 cites·20 claims
- 0444US2023113869A1Substrate transfer apparatusSAMSUNG ELECTRONICS LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →