Inventor · disambiguated record
Daiji Morita
Also filed as: MORITA DAIJI
16 granted patents·12 pending applications·6 citations·filing 2009–2021
85Inventor score
Top patents by PatentIndex Score
28 records- 0183US11480947B2Control information generation device and control information generation method for controlling an additive manufacturing apparatus using bead width correctionMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Oct 25, 2022·3 cites·9 claims
- 0278US11108214B2Wavelength combining laser apparatusMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Aug 31, 2021·2 cites·14 claims
- 0377US12246382B2Additive manufacturing apparatusMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Mar 11, 2025·1 cites·21 claims
- 0463US12311465B23D printing apparatus, 3D printing method, and machine learning deviceMITSUBISHI ELECTRIC CORP·Filed 2019·Granted May 27, 2025·0 cites·14 claims
- 0559US11351736B2Numerical control device and method for controlling additive manufacturing apparatusMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Jun 7, 2022·0 cites·11 claims
- 0658US11179802B2Laser machining head and laser machining apparatusMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Nov 23, 2021·0 cites·8 claims
- 0755US2024383041A1Additive manufacturing apparatus and method for metal additive manufactured productsMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 0854US11383327B2Additive manufacturing method, machining-path generation method, and additive manufacturing deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Jul 12, 2022·0 cites·7 claims
- 0954US2024253162A1Additive manufacturing apparatus and additive manufacturing methodMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 1053US12508775B2Additive manufacturing method, additive manufacturing apparatus, and additive manufacturing systemMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Dec 30, 2025·0 cites·24 claims
- 1152US2022324057A1Additive manufacturing apparatus, additive manufacturing method, and storage mediumMITSUBISHI ELECTRIC CORP·Filed 2019·Application pending·0 cites
- 1249US2023131125A1Additive manufacturing apparatus, additive manufacturing method, and machine learning deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Application pending·0 cites
- 1348US10498107B1Laser deviceMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Dec 3, 2019·0 cites·10 claims
- 1448US2012074105A1Laser machining method and apparatusOKAMOTO TATSUKI·Filed 2009·Application pending·0 cites
- 1547US10864600B2Laser machining deviceMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Dec 15, 2020·0 cites·6 claims
- 1647US2025083229A1Joining method, joining device, and joining systemMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 1745US2023294170A13d printing apparatusMITSUBISHI ELECTRIC CORP·Filed 2020·Application pending·0 cites
- 1845US2021323092A1Additive manufacturing apparatus and additive manufacturing methodMITSUBISHI ELECTRIC CORP·Filed 2019·Application pending·0 cites
- 1944US11325190B2Additive manufacturing method and machining-path generation methodMITSUBISHI ELECTRIC CORP·Filed 2018·Granted May 10, 2022·0 cites·4 claims
- 2043US10840670B2Laser oscillatorMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Nov 17, 2020·0 cites·9 claims
- 2143US10714902B2Laser oscillatorMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Jul 14, 2020·0 cites·12 claims
- 2243US9331457B2Semiconductor laser apparatusMITSUBISHI ELECTRIC CORP·Filed 2013·Granted May 3, 2016·0 cites·12 claims
- 2343US2016329685A1Semiconductor laser deviceMITSUBISHI ELECTRIC CORP·Filed 2014·Application pending·0 cites
- 2438US10461506B2Laser oscillation apparatusMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Oct 29, 2019·0 cites·7 claims
- 2535US10571708B2Beam shaping device and laser oscillatorMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Feb 25, 2020·0 cites·17 claims
- 2635US2018175590A1Semiconductor laser deviceMITSUBISHI ELECTRIC CORP·Filed 2015·Application pending·0 cites
- 2733US2017207605A1Semiconductor laser deviceMITSUBISHI ELECTRIC CORP·Filed 2015·Application pending·0 cites
- 2833US2016344162A1Beam combining device and output recovery method for beam combining deviceMITSUBISHI ELECTRIC CORP·Filed 2015·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Daiji Morita files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →