Inventor · disambiguated record
David Jerome Mountain
Also filed as: MOUNTAIN DAVID GARRETT · MOUNTAIN DAVID J · MOUNTAIN DAVID JEROME
11 granted patents·1 pending application·340 citations·filing 1996–2023
90Inventor score
Files withUS NATIONAL SECURITY AGENCY5THE GOVERNMENT OF THE UNITED STATES AS REPRESENTED BY THE DIRECTOR NAT SECURITY AGENCY3UNITEED STATES OF AMERICA AS R1US DIRECTOR OF THE NAT SECURIT1
Top patents by PatentIndex Score
12 records- 0190US11922299B1General purpose neural processorTHE GOVERNMENT OF THE UNITED STATES AS REPRESENTED BY THE DIRECTOR NAT SECURITY AGENCY·Filed 2023·Granted Mar 5, 2024·1 cites·20 claims
- 0289US11138500B1General purpose neural processorTHE GOVERNMENT OF THE UNITED STATES AS REPRESENTED BY THE DIRECTOR NAT SECURITY AGENCY·Filed 2019·Granted Oct 5, 2021·7 cites·4 claims
- 0389US7232740B1Method for bumping a thin waferUS NATIONAL SECURITY AGENCY·Filed 2005·Granted Jun 19, 2007·22 cites·22 claims
- 0489US6013534AMethod of thinning integrated circuits received in die formUS NATIONAL SECURITY AGENCY·Filed 1997·Granted Jan 11, 2000·124 cites·24 claims
- 0588US5656552AMethod of making a thin conformal high-yielding multi-chip moduleFiled 1996·Granted Aug 12, 1997·128 cites·48 claims
- 0687US7297613B1Method of fabricating and integrating high quality decoupling capacitorsUS NATIONAL SECURITY AGENCY·Filed 2005·Granted Nov 20, 2007·16 cites·24 claims
- 0771US11640524B1General purpose neural processorTHE GOVERNMENT OF THE UNITED STATES AS REPRESENTED BY THE DIRECTOR NAT SECURITY AGENCY·Filed 2021·Granted May 2, 2023·0 cites·3 claims
- 0865US6017822AMethod of thinning semiconductor wafer of smaller diameter than thinning equipment was designed forUS NATIONAL SECURITY AGENCY·Filed 1998·Granted Jan 25, 2000·33 cites·15 claims
- 0957US7351608B1Method of precisely aligning components in flexible integrated circuit moduleUS DIRECTOR OF THE NAT SECURIT·Filed 2004·Granted Apr 1, 2008·8 cites·32 claims
- 1048US2002077966A1Personalised financial products and computer implemented management systemFiled 2001·Application pending·0 cites
- 1139US7452746B1Method of fabricating a flexible organic integrated circuitUNITEED STATES OF AMERICA AS R·Filed 2006·Granted Nov 18, 2008·0 cites·8 claims
- 1237US6977212B2Fabricating a semiconductor device using fully cured bisbenzocyclobuteneUS NATIONAL SECURITY AGENCY·Filed 2004·Granted Dec 20, 2005·1 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →