Inventor · disambiguated record
Daisuke Nishida
Also filed as: NISHIDA DAISUKE
18 granted patents·17 pending applications·120 citations·filing 2004–2025
93Inventor score
Top patents by PatentIndex Score
35 records- 0196US7999304B2Semiconductor deviceTOSHIBA KK·Filed 2008·Granted Aug 16, 2011·52 cites·8 claims
- 0291US8110865B2Semiconductor device and method for manufacturing the sameTANAKA MASAYUKI·Filed 2010·Granted Feb 7, 2012·12 cites·5 claims
- 0388US7723772B2Semiconductor memory device and method of manufacturing the sameTOSHIBA KK·Filed 2007·Granted May 25, 2010·11 cites·8 claims
- 0484US9754961B2Semiconductor memory device and method for manufacturing sameTOSHIBA MEMORY CORP·Filed 2016·Granted Sep 5, 2017·4 cites·12 claims
- 0582US7612404B2Semiconductor deviceTOSHIBA KK·Filed 2007·Granted Nov 3, 2009·10 cites·20 claims
- 0681US7927949B2Semiconductor memory device and method of manufacturing the sameTOSHIBA KK·Filed 2010·Granted Apr 19, 2011·5 cites·6 claims
- 0779US8105679B2Actinic radiation curable jet-printing inkJONAI KAZUHIRO·Filed 2006·Granted Jan 31, 2012·7 cites·16 claims
- 0876US11195744B2Substrate treatment apparatus and manufacturing method of a semiconductor deviceTOSHIBA MEMORY CORP·Filed 2019·Granted Dec 7, 2021·2 cites·4 claims
- 0976US8008152B2Method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2007·Granted Aug 30, 2011·4 cites·10 claims
- 1073US7682899B2Method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2007·Granted Mar 23, 2010·3 cites·8 claims
- 1173US7635891B2Semiconductor deviceTOSHIBA KK·Filed 2007·Granted Dec 22, 2009·5 cites·20 claims
- 1270US12513901B2Memory device with periodically varying memory film thicknessKIOXIA CORP·Filed 2022·Granted Dec 30, 2025·0 cites·18 claims
- 1365US8609487B2Method of manufacturing semiconductor deviceNATORI KATSUAKI·Filed 2010·Granted Dec 17, 2013·2 cites·7 claims
- 1465US2025278859A1Image point cloud data processing device, image point cloud data processing method, and storage medium storing image point cloud data processing programMITSUBISHI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 1562US7635890B2Semiconductor deviceTOSHIBA KK·Filed 2007·Granted Dec 22, 2009·2 cites·12 claims
- 1662US2024324227A1Semiconductor device and manufacturing method thereofKIOXIA CORP·Filed 2024·Application pending·0 cites
- 1759US9112244B2Battery packNISHIDA DAISUKE·Filed 2012·Granted Aug 18, 2015·1 cites·8 claims
- 1859US2025290580A1Gasket and joint structureIHARA SCIENCE CORP·Filed 2025·Application pending·0 cites
- 1951US8278697B2Semiconductor device and method for manufacturing the sameTANAKA MASAYUKI·Filed 2012·Granted Oct 2, 2012·0 cites·5 claims
- 2049US2024315036A1Semiconductor memory device and method for manufacturing the sameKIOXIA CORP·Filed 2024·Application pending·0 cites
- 2148US2009117343A1Active energy beam-curable inkjet inkTOYO INK MFG CO·Filed 2006·Application pending·0 cites
- 2248US2007241390A1Semiconductor device and method for manufacturing the sameTANAKA MASAYUKI·Filed 2007·Application pending·0 cites
- 2347US2022084799A1Semiconductor manufacturing apparatusKIOXIA CORP·Filed 2021·Application pending·0 cites
- 2446US2009001448A1Semiconductor memory device and method of manufacturing the sameSEKINE KATSUYUKI·Filed 2008·Application pending·0 cites
- 2546US2006275771A1Quantitative reagent, method and equipment of substance utilizing fluorescence lifetimeSUZUKI HIDEYUKI·Filed 2004·Application pending·0 cites
- 2644US10559479B2Semiconductor manufacturing apparatus and manufacturing method of semiconductor deviceTOSHIBA MEMORY CORP·Filed 2018·Granted Feb 11, 2020·0 cites·16 claims
- 2744US2009273021A1Semiconductor device and method for manufacturing the sameSEKINE KATSUYUKI·Filed 2009·Application pending·0 cites
- 2840US2010006923A1Semiconductor device and method for manufacturing the sameFUJITSUKA RYOTA·Filed 2009·Application pending·0 cites
- 2939US2009256192A1Nonvolatile semiconductor memory device and method of manufacturing the sameFUJITSUKA RYOTA·Filed 2009·Application pending·0 cites
- 3037US10263008B2Semiconductor memory device and method of manufacturing the sameTOSHIBA MEMORY CORP·Filed 2016·Granted Apr 16, 2019·0 cites·10 claims
- 3136US2008277716A1Semiconductor deviceNISHIDA DAISUKE·Filed 2008·Application pending·0 cites
- 3235US2017062460A1Semiconductor memory device and method for manufacturing sameTOSHIBA KK·Filed 2016·Application pending·0 cites
- 3335US2007183208A1Nonvolatile semiconductor memory device and data writing method thereforTANAKA MASAYUKI·Filed 2007·Application pending·0 cites
- 3434US2007272966A1Nonvolatile semiconductor memory device and method of fabricating the sameNISHIDA DAISUKE·Filed 2007·Application pending·0 cites
- 3533US2017018563A1Semiconductor memory device and method for manufacturing the sameTOSHIBA KK·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →