Inventor · disambiguated record
David Nozadze
Also filed as: NOZADZE DAVID
13 granted patents·16 pending applications·4 citations·filing 2019–2024
84Inventor score
Files withCISCO TECH INC29
Top patents by PatentIndex Score
29 records- 0182US10674598B1Measuring effective dielectric constant using via-stub resonanceCISCO TECH INC·Filed 2019·Granted Jun 2, 2020·3 cites·20 claims
- 0280US11202368B2Providing one or more carbon layers to a copper conductive material to reduce power loss in a power planeCISCO TECH INC·Filed 2020·Granted Dec 14, 2021·1 cites·19 claims
- 0378US12289831B2Providing one or more carbon layers to a copper conductive material to reduce power loss in a power planeCISCO TECH INC·Filed 2023·Granted Apr 29, 2025·0 cites·20 claims
- 0478US12160948B2Integrating graphene into the skin depth region of high speed communications signals for a printed circuit boardCISCO TECH INC·Filed 2023·Granted Dec 3, 2024·0 cites·20 claims
- 0573US11751322B2Integrating graphene into the skin depth region of high speed communications signals for a printed circuit boardCISCO TECH INC·Filed 2022·Granted Sep 5, 2023·0 cites·20 claims
- 0672US11706870B2Providing one or more carbon layers to a copper conductive material to reduce power loss in a power planeCISCO TECH INC·Filed 2021·Granted Jul 18, 2023·0 cites·20 claims
- 0768US12003282B2Channel predictive behavior and fault analysisCISCO TECH INC·Filed 2023·Granted Jun 4, 2024·0 cites·20 claims
- 0868US11330702B2Integrating graphene into the skin depth region of high speed communications signals for a printed circuit boardCISCO TECH INC·Filed 2020·Granted May 10, 2022·0 cites·17 claims
- 0965US11777239B2Twinaxial cable port structure coupled to an integrated circuit socketCISCO TECH INC·Filed 2022·Granted Oct 3, 2023·0 cites·20 claims
- 1062US11606152B2Channel predictive behavior and fault analysisCISCO TECH INC·Filed 2021·Granted Mar 14, 2023·0 cites·17 claims
- 1158US2025275055A1Novel high-speed via impedance matching methodology using low dielectric constant backdrill filling materialCISCO TECH INC·Filed 2024·Application pending·0 cites
- 1257US2025309705A1Electric power generation using planar array of ferrite coresCISCO TECH INC·Filed 2024·Application pending·0 cites
- 1355US11425821B2Optimizing design and performance for printed circuit boardsCISCO TECH INC·Filed 2019·Granted Aug 23, 2022·0 cites·20 claims
- 1455US2025133652A1Printed circuit board assemblyCISCO TECH INC·Filed 2023·Application pending·0 cites
- 1555US2024345180A1System and method for determining cable performance based on frequency dependent skewCISCO TECH INC·Filed 2024·Application pending·0 cites
- 1655US2025029931A1Package assembly for integrated circuitCISCO TECH INC·Filed 2023·Application pending·0 cites
- 1755US2025311091A1Pcb with breakout to enable higher density, layer count and enhanced performanceCISCO TECH INC·Filed 2024·Application pending·0 cites
- 1854US2025151198A1Power method for higher current asic power deliveryCISCO TECH INC·Filed 2024·Application pending·0 cites
- 1954US2024355737A1Via ground structuresCISCO TECH INC·Filed 2023·Application pending·0 cites
- 2054US2025261301A1Managing crosstalk for high data rate interfacesCISCO TECH INC·Filed 2024·Application pending·0 cites
- 2154US2025240873A1Multi-lamination structure that eliminates micro cavity resonanceCISCO TECH INC·Filed 2024·Application pending·0 cites
- 2254US2025240870A1Power delivery system for high density signaling and high power delivery applicationCISCO TECH INC·Filed 2024·Application pending·0 cites
- 2353US10735039B1Removal of channel impairments due to skew and channel asymmetry with a composite filterCISCO TECH INC·Filed 2019·Granted Aug 4, 2020·0 cites·20 claims
- 2453US2025212319A1Balancing loss across all ports on printed circuit board tracesCISCO TECH INC·Filed 2023·Application pending·0 cites
- 2553US2025140447A1Coupled conductors in twinax cable and stripline printed circuit board for skew mitigationCISCO TECH INC·Filed 2024·Application pending·0 cites
- 2652US2023378677A1High speed and high density cable interconnectsCISCO TECH INC·Filed 2023·Application pending·0 cites
- 2752US2025280496A1Via assembly for printed circuit boardCISCO TECH INC·Filed 2024·Application pending·0 cites
- 2850US11894296B2Integrated circuit package with heatsinkCISCO TECH INC·Filed 2021·Granted Feb 6, 2024·0 cites·19 claims
- 2950US2024332154A1Ball map patternCISCO TECH INC·Filed 2023·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when David Nozadze files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →