Inventor · disambiguated record
Daniel Obermeier
Also filed as: OBERMEIER DANIEL
1 granted patent·2 pending applications·0 citations·filing 2020–2024
7Inventor score
Files withINFINEON TECHNOLOGIES AG3
Top patents by PatentIndex Score
3 records- 0157US2024359212A1Ultrasonic device and method of forming the same, ultrasonic assemblies and methods of forming the sameINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0247US11410906B2Semiconductor package and method for fabricating a semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted Aug 9, 2022·0 cites·16 claims
- 0339US2024404982A1Power semiconductor module having a metallic clip with ultrasonically welded contact regions and method of producing the power semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →