Inventor · disambiguated record

Daniel B. O’Brien

Also filed as: OBRIEN DANIEL B · O’BRIEN DANIEL B

0 granted patents·2 pending applications·0 citations·filing 2021–2023

Technology areasH10W

Files withINTEL CORP2

Top patents by PatentIndex Score

2 records

0156US2024429126A1Conductive lines having molybdenum liner and tungsten fill for advanced integrated circuit structure fabricationINTEL CORP·Filed 2023·Application pending·0 cites
0246US2023143021A1Integrated circuit interconnect structures including copper-free viasINTEL CORP·Filed 2021·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →