Inventor · disambiguated record
Daichi Ogawa
Also filed as: OGAWA DAICHI
5 granted patents·2 pending applications·8 citations·filing 2010–2022
71Inventor score
Top patents by PatentIndex Score
7 records- 0187US11966656B2Server, electronic device, server communication method, device communication method, and communication systemROLAND CORP·Filed 2022·Granted Apr 23, 2024·4 cites·16 claims
- 0284US10526433B2(Meth)acrylate compositionIDEMITSU KOSAN CO·Filed 2015·Granted Jan 7, 2020·2 cites·20 claims
- 0378US11364663B2Thermosetting composition, and method for manufacturing thermoset resinIDEMITSU KOSAN CO·Filed 2020·Granted Jun 21, 2022·1 cites·21 claims
- 0473US10668650B2Thermosetting composition, and method for manufacturing thermoset resinIDEMITSU KOSAN CO·Filed 2015·Granted Jun 2, 2020·1 cites·8 claims
- 0553US2013237660A1(meth)acrylate compositionIWASAKI TAKESHI·Filed 2011·Application pending·0 cites
- 0648US11359158B2Lubricating oil composition, lubrication method, and transmissionIDEMITSU KOSAN CO·Filed 2017·Granted Jun 14, 2022·0 cites·10 claims
- 0733US2012142867A1Acrylate compositionIWASAKI TAKESHI·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →