Inventor · disambiguated record
Daisuke Orino
Also filed as: ORINO DAISUKE
3 granted patents·36 citations·filing 1999–2001
71Inventor score
Top patents by PatentIndex Score
3 records- 0176US6492030B1Thermoplastic resin composition having low permittivity, prepreg, laminated plate and laminated material for circuit using the sameTOMOEGAWA PAPER CO LTD·Filed 2000·Granted Dec 10, 2002·22 cites·18 claims
- 0262US6713143B2Thermosetting low-dielectric resin composition and use thereofTOMEGAWA PAPER CO LTD·Filed 2001·Granted Mar 30, 2004·5 cites·11 claims
- 0346US6346598B1Thermosetting low-dielectric resin composition and use thereofTOMOEGAWA PAPER CO LTD·Filed 1999·Granted Feb 12, 2002·9 cites·11 claims
Join the waitlist — get patent alerts
Get an alert when Daisuke Orino files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →