Inventor · disambiguated record
Daniel Pantuso
Also filed as: PANTUSO DANIEL
12 granted patents·3 pending applications·91 citations·filing 2002–2023
88Inventor score
Files withINTEL CORP15
Top patents by PatentIndex Score
15 records- 0198US11594524B2Fabrication and use of through silicon vias on double sided interconnect deviceINTEL CORP·Filed 2022·Granted Feb 28, 2023·6 cites·20 claims
- 0291US11251156B2Fabrication and use of through silicon vias on double sided interconnect deviceINTEL CORP·Filed 2015·Granted Feb 15, 2022·8 cites·20 claims
- 0385US11056356B1Fluid viscosity control during wafer bondingINTEL CORP·Filed 2018·Granted Jul 6, 2021·5 cites·9 claims
- 0485US6525419B1Thermally coupling electrically decoupling cooling device for integrated circuitsINTEL CORP·Filed 2002·Granted Feb 25, 2003·45 cites·10 claims
- 0580US10720345B1Wafer to wafer bonding with low wafer distortionINTEL CORP·Filed 2018·Granted Jul 21, 2020·3 cites·13 claims
- 0673US6646340B2Thermally coupling electrically decoupling cooling device for integrated circuitsINTEL CORP·Filed 2003·Granted Nov 11, 2003·21 cites·50 claims
- 0772US9343411B2Techniques for enhancing fracture resistance of interconnectsINTEL CORP·Filed 2013·Granted May 17, 2016·3 cites·27 claims
- 0851US2024419883A1Thermal conductivity in integrated circuitsINTEL CORP·Filed 2023·Application pending·0 cites
- 0950US11195719B2Reducing in-plane distortion from wafer to wafer bonding using a dummy waferINTEL CORP·Filed 2018·Granted Dec 7, 2021·0 cites·15 claims
- 1049US9691716B2Techniques for enhancing fracture resistance of interconnectsINTEL CORP·Filed 2016·Granted Jun 27, 2017·0 cites·20 claims
- 1148US2024370615A1Methods and apparatus to implement thermal gradient projection and design feedback on power deliveryINTEL CORP·Filed 2023·Application pending·0 cites
- 1244US11171057B2Semiconductor fin design to mitigate fin collapseINTEL CORP·Filed 2016·Granted Nov 9, 2021·0 cites·20 claims
- 1344US10707186B1Compliant layer for wafer to wafer bondingINTEL CORP·Filed 2018·Granted Jul 7, 2020·0 cites·8 claims
- 1443US10825752B2Integrated thermoelectric coolingINTEL CORP·Filed 2013·Granted Nov 3, 2020·0 cites·14 claims
- 1542US2022415807A1Thermal management structures in semiconductor devices and methods of fabricationINTEL CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →