Inventor · disambiguated record
Dae-Hyun Park
Also filed as: PARK DAE H · PARK DAE-HYUN
46 granted patents·21 pending applications·177 citations·filing 2004–2021
97Inventor score
Top patents by PatentIndex Score
67 records- 0196US9853003B1Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Dec 26, 2017·31 cites·20 claims
- 0294US9984979B2Fan-out semiconductor package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted May 29, 2018·10 cites·34 claims
- 0392US11499494B1Method for diagnosing fuel leakage of a vehicleHYUNDAI MOTOR CO LTD·Filed 2021·Granted Nov 15, 2022·2 cites·11 claims
- 0492US10256200B2Electronic component package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2018·Granted Apr 9, 2019·7 cites·20 claims
- 0592US10199337B2Electronic component package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Feb 5, 2019·9 cites·2 claims
- 0691US10762479B2Method and system for processing blockchain-based real-time transactionSAMSUNG SDS CO LTD·Filed 2018·Granted Sep 1, 2020·12 cites·14 claims
- 0790US10083929B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Sep 25, 2018·7 cites·17 claims
- 0888US10262949B2Fan-out semiconductor package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2018·Granted Apr 16, 2019·4 cites·40 claims
- 0988US10157851B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Dec 18, 2018·5 cites·18 claims
- 1088US7764149B2Electromagnetic bandgap structure and printed circuit boardSAMSUNG ELECTRO MECH·Filed 2008·Granted Jul 27, 2010·18 cites·11 claims
- 1185US10157886B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Dec 18, 2018·4 cites·15 claims
- 1281US8279616B2Printed circuit board with embedded chip capacitorKIM HAN·Filed 2011·Granted Oct 2, 2012·4 cites·9 claims
- 1379US10600679B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Mar 24, 2020·3 cites·21 claims
- 1479US8699234B2EMI noise shield board including electromagnetic bandgap structureKIM HAN·Filed 2011·Granted Apr 15, 2014·6 cites·8 claims
- 1578US9496594B2Printed circuit board and printed circuit board for camera moduleSAMSUNG ELECTRO MECH·Filed 2014·Granted Nov 15, 2016·3 cites·31 claims
- 1678US8183468B2Electromagnetic bandgap structure, printed circuit board comprising this and method thereofKIM HAN·Filed 2008·Granted May 22, 2012·7 cites·8 claims
- 1777US10304807B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2018·Granted May 28, 2019·2 cites·20 claims
- 1876US8035991B2Electromagnetic bandgap structure and printed circuit boardSAMSUNG ELECTRO MECH·Filed 2008·Granted Oct 11, 2011·5 cites·14 claims
- 1973US10217631B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Feb 26, 2019·2 cites·22 claims
- 2071US8258408B2Electromagnetic interference noise reduction board using electromagnetic bandgap structureKIM HAN·Filed 2009·Granted Sep 4, 2012·5 cites·7 claims
- 2171US8212150B2Electromagnetic interference noise reduction board using electromagnetic bandgap structureKIM HAN·Filed 2009·Granted Jul 3, 2012·5 cites·8 claims
- 2271US8153907B2Electromagnetic bandgap structure and printed circuit boardPARK DAE-HYUN·Filed 2008·Granted Apr 10, 2012·6 cites·6 claims
- 2369US8081052B2Electromagnetic bandgap structure and printed circuit boardKIM HAN·Filed 2008·Granted Dec 20, 2011·4 cites·9 claims
- 2468US11037884B2Semiconductor package having through-hole including shielding wiring structureSAMSUNG ELECTRO MECH·Filed 2019·Granted Jun 15, 2021·1 cites·17 claims
- 2568US8422248B2Electromagnetic bandgap structure and printed circuit boardKIM HAN·Filed 2011·Granted Apr 16, 2013·1 cites·6 claims
- 2667US8253025B2Printed circuit board having electromagnetic bandgap structureKIM HAN·Filed 2009·Granted Aug 28, 2012·3 cites·3 claims
- 2767US8227704B2Printed circuit board having electromagnetic bandgap structurePARK DAE-HYUN·Filed 2009·Granted Jul 24, 2012·4 cites·4 claims
- 2864US10333193B2Printed circuit board and printed circuit board for camera moduleSAMSUNG ELECTRO MECH·Filed 2015·Granted Jun 25, 2019·1 cites·38 claims
- 2963US8952265B2Electromagnetic interference noise reduction package boardKIM HAN·Filed 2012·Granted Feb 10, 2015·2 cites·3 claims
- 3061US10667386B2Circuit board and conductive pattern structureSAMSUNG ELECTRO MECH·Filed 2019·Granted May 26, 2020·0 cites·8 claims
- 3161US9313893B2Substrate having electronic component embedded therein and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Apr 12, 2016·1 cites·22 claims
- 3257US7876045B2Plasma display panel having barrier ribs with pigments with different mixing ratiosLG ELECTRONICS INC·Filed 2008·Granted Jan 25, 2011·0 cites·20 claims
- 3354US10251259B2Circuit board and conductive pattern structureSAMSUNG ELECTRO MECH·Filed 2016·Granted Apr 2, 2019·0 cites·20 claims
- 3454US8076998B2Electromagnetic bandgap structure and printed circuit boardBONG KANG-WOOK·Filed 2009·Granted Dec 13, 2011·1 cites·17 claims
- 3554US2009085691A1Printed circuit board with embedded chip capacitor and chip capacitor embedment methodSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 3652US9526164B2Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2016·Granted Dec 20, 2016·0 cites·18 claims
- 3752US8853560B2Electromagnetic bandgap structure and printed circuit boardPARK DAE-HYUN·Filed 2012·Granted Oct 7, 2014·0 cites·9 claims
- 3852US7563149B2Sheet for manufacturing plasma display apparatus and method for manufacturing plasma displayLG ELECTRONICS INC·Filed 2005·Granted Jul 21, 2009·0 cites·13 claims
- 3951US10553541B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2018·Granted Feb 4, 2020·0 cites·19 claims
- 4051US8242377B2Printed circuit board having electromagnetic bandgap structureJUNG HYO-JIC·Filed 2009·Granted Aug 14, 2012·1 cites·4 claims
- 4151US7965521B2Electromagnetic bandgap structure and printed circuit boardSAMSUNG ELECTRO MECH·Filed 2008·Granted Jun 21, 2011·0 cites·10 claims
- 4251US2018293576A1System for custom currency transaction based on blockchain and operating method thereofSAMSUNG SDS CO LTD·Filed 2018·Application pending·0 cites
- 4351US2010132996A1Electromagnetic bandgap structure and printed circuit boardSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 4450US8289099B2Electromagnetic bandgap structure and circuit boardKIM HAN·Filed 2009·Granted Oct 16, 2012·0 cites·18 claims
- 4549US10923433B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 16, 2021·0 cites·24 claims
- 4649US2009084582A1Printed circuit board having stepped conduction layerSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 4748US2022012819A1Community management apparatus and community management method therebyNAVER CORP·Filed 2021·Application pending·0 cites
- 4847US2014003012A1Capacitor-embedded printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 4946US11729127B2Methods and apparatuses for generating bundle invitation link for plurality of communitiesNAVER CORP·Filed 2021·Granted Aug 15, 2023·0 cites·19 claims
- 5046US2008136329A1Plasma display panel and method for manufacturing the sameLG ELECTRONICS INC·Filed 2007·Application pending·0 cites
Showing the top 50 of 67 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →