Inventor · disambiguated record

Dahee Park

Also filed as: PARK DAHEE

3 granted patents·2 pending applications·2 citations·filing 2021–2024

55Inventor score

Technology areasH10W

Files withSAMSUNG ELECTRONICS CO LTD5

Top patents by PatentIndex Score

5 records

0187US11972995B2Semiconductor package and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Apr 30, 2024·2 cites·20 claims
0273US12444662B2Semiconductor package and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Oct 14, 2025·0 cites·20 claims
0362US11658086B2Semiconductor package and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 23, 2023·0 cites·20 claims
0452US2025079248A1Semiconductor package and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
0551US2024379620A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →