Inventor · disambiguated record
David Perry
Also filed as: PERRY DAVID · PERRY DAVID K
8 granted patents·1 pending application·187 citations·filing 1999–2005
88Inventor score
Top patents by PatentIndex Score
9 records- 0195US6189896B1Controlled leakage rotating seal ring with elements for receiving and holding a lubricant on a face thereofCATERPILLAR INC·Filed 1999·Granted Feb 20, 2001·101 cites·18 claims
- 0289US6945846B1Polishing pad for use in chemical/mechanical planarization of semiconductor wafers having a transparent window for end-point determination and method of makingRAYTECH INNOVATIVE SOLUTIONS L·Filed 2005·Granted Sep 20, 2005·18 cites·9 claims
- 0386US6875077B2Polishing pad for use in chemical/mechanical planarization of semiconductor wafers having a transparent window for end-point determination and method of makingRAYTECH INNOVATIVE SOLUTIONS I·Filed 2003·Granted Apr 5, 2005·30 cites·14 claims
- 0478US6899610B2Retaining ring with wear pad for use in chemical mechanical planarizationRAYTECH INNOVATIVE SOLUTIONS I·Filed 2002·Granted May 31, 2005·19 cites·40 claims
- 0563US7025668B2Gradient polishing pad made from paper-making fibers for use in chemical/mechanical planarization of wafersRAYTECH INNOVATIVE SOLUTIONS L·Filed 2003·Granted Apr 11, 2006·10 cites·4 claims
- 0651US6863774B2Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making sameRAYTECH INNOVATIVE SOLUTIONS I·Filed 2002·Granted Mar 8, 2005·5 cites·1 claims
- 0750US6979256B2Retaining ring with wear pad for use in chemical mechanical planarizationRAYTECH INNOVATIVE SOLUTIONS L·Filed 2004·Granted Dec 27, 2005·4 cites·9 claims
- 0845US2005085169A1Polishing pad for use in chemical - mechanical palanarization of semiconductor wafers and method of making sameFiled 2004·Application pending·0 cites
- 0936US6964601B2Method for securing a polishing pad to a platen for use in chemical-mechanical polishing of wafersRAYTECH INNOVATIVE SOLUTIONS L·Filed 2003·Granted Nov 15, 2005·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →