Inventor · disambiguated record
Darko R. Popovic
Also filed as: POPOVIC DARKO · POPOVIC DARKO R
5 granted patents·4 pending applications·28 citations·filing 2009–2024
74Inventor score
Technology areasH10W
Top patents by PatentIndex Score
9 records- 0189US12062648B2Multiple (multi-) die integrated circuit (IC) packages for supporting higher connection density, and related fabrication methodsQUALCOMM INC·Filed 2021·Granted Aug 13, 2024·2 cites·33 claims
- 0289US8390109B2Chip package with plank stack of semiconductor diesPOPOVIC DARKO R·Filed 2011·Granted Mar 5, 2013·22 cites·20 claims
- 0369US9755391B2Crosstalk reduction in electrical interconnectsORACLE INT CORP·Filed 2015·Granted Sep 5, 2017·2 cites·8 claims
- 0462US7863743B1Capactive connectors with enhanced capacitive couplingORACLE AMERICA INC·Filed 2009·Granted Jan 4, 2011·2 cites·20 claims
- 0558US2025300080A1INTEGRATED CIRCUITS (ICs) HAVING SEPARATE SIGNAL AND POWER DISTRIBUTION NETWORK (PDN) INTERCONNECT STRUCTURES FOR REDUCED POWER SIGNAL ROUTING CONGESTION AND PATH LENGTHS, AND RELATED THREE-DIMENSIONAL (3D) ICs (3DICs) AND FABRICATION METHODSQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0656US2025096207A1Package comprising a bridge located between metallization portionsQUALCOMM INC·Filed 2023·Application pending·0 cites
- 0754US2024363605A1Stacked integrated circuit device including integrated capacitor deviceQUALCOMM INC·Filed 2023·Application pending·0 cites
- 0852US2024038831A1Package with a substrate comprising embedded stacked trench capacitor devicesQUALCOMM INC·Filed 2022·Application pending·0 cites
- 0948US10263380B2Crosstalk reduction in electrical interconnectsORACLE INT CORP·Filed 2017·Granted Apr 16, 2019·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →