Inventor · disambiguated record
David S. Pratt
Also filed as: PRATT DAVID · PRATT DAVID S · PRATT DAVID S JR · PRATT DAVID STORRS
46 granted patents·4 pending applications·485 citations·filing 1979–2024
98Inventor score
Top patents by PatentIndex Score
50 records- 0194US10127596B1Systems, methods, and devices for generating recommendations of unique itemsVAST COM INC·Filed 2014·Granted Nov 13, 2018·76 cites·5 claims
- 0294US7531443B2Method and system for fabricating semiconductor components with through interconnects and back side redistribution conductorsMICRON TECHNOLOGY INC·Filed 2006·Granted May 12, 2009·25 cites·51 claims
- 0393US9276319B2Electronic device antenna with multiple feeds for covering three communications bandsAPPLE INC·Filed 2013·Granted Mar 1, 2016·18 cites·20 claims
- 0492US7800238B2Surface depressions for die-to-die interconnects and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2008·Granted Sep 21, 2010·19 cites·17 claims
- 0591US8193092B2Semiconductor devices including a through-substrate conductive member with an exposed end and methods of manufacturing such semiconductor devicesPRATT DAVID S·Filed 2007·Granted Jun 5, 2012·16 cites·30 claims
- 0691US8084854B2Pass-through 3D interconnect for microelectronic dies and associated systems and methodsPRATT DAVID S·Filed 2007·Granted Dec 27, 2011·22 cites·13 claims
- 0789US4249541ABiopsy devicePRATT DAVID S·Filed 1979·Granted Feb 10, 1981·159 cites·16 claims
- 0888US9337537B2Antenna with tunable high band parasitic elementAPPLE INC·Filed 2013·Granted May 10, 2016·10 cites·17 claims
- 0988US8674522B1Castle-like chop mask for forming staggered datalines for improved contact isolation and pattern thereofPRATT DAVID·Filed 2012·Granted Mar 18, 2014·10 cites·11 claims
- 1088US7952170B2System including semiconductor components having through interconnects and back side redistribution conductorsMICRON TECHNOLOGY INC·Filed 2010·Granted May 31, 2011·8 cites·11 claims
- 1186US9209166B2Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devicesMICRON TECHNOLOGY INC·Filed 2015·Granted Dec 8, 2015·4 cites·17 claims
- 1285US10963942B1Systems, methods, and devices for generating recommendations of unique itemsVAST COM INC·Filed 2018·Granted Mar 30, 2021·4 cites·12 claims
- 1382US7886267B2Multiple-developer architecture for facilitating the localization of software applicationsSYMANTEC CORP·Filed 2006·Granted Feb 8, 2011·16 cites·21 claims
- 1481US11515204B2Methods for forming conductive vias, and associated devices and systemsMICRON TECHNOLOGY INC·Filed 2020·Granted Nov 29, 2022·1 cites·25 claims
- 1581US8853868B2Semiconductor structures including sub-resolution alignment marksMICRON TECHNOLOGY INC·Filed 2013·Granted Oct 7, 2014·4 cites·23 claims
- 1680US12387981B2Methods for forming conductive vias, and associated devices and systemsMICRON TECHNOLOGY INC·Filed 2024·Granted Aug 12, 2025·0 cites·20 claims
- 1779US9711457B2Semiconductor devices with recessed interconnectsMICRON TECHNOLOGY INC·Filed 2015·Granted Jul 18, 2017·2 cites·14 claims
- 1879US9209158B2Pass-through 3D interconnect for microelectronic dies and associated systems and methodsPRATT DAVID S·Filed 2011·Granted Dec 8, 2015·4 cites·14 claims
- 1978US8367471B2Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devicesMICRON TECHNOLOGY INC·Filed 2007·Granted Feb 5, 2013·6 cites·27 claims
- 2078US7951709B2Method and apparatus providing integrated circuit having redistribution layer with recessed connectorsMICRON TECHNOLOGY INC·Filed 2010·Granted May 31, 2011·3 cites·20 claims
- 2175US8585915B2Methods for fabricating sub-resolution alignment marks on semiconductor structuresPRATT DAVID S·Filed 2007·Granted Nov 19, 2013·5 cites·18 claims
- 2275US8021981B2Redistribution layers for microfeature workpieces, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2006·Granted Sep 20, 2011·5 cites·32 claims
- 2374US11990370B2Methods for forming conductive vias, and associated devices and systemsMICRON TECHNOLOGY INC·Filed 2022·Granted May 21, 2024·0 cites·20 claims
- 2471US8664077B2Method for forming self-aligned overlay markNAIR VINAY·Filed 2012·Granted Mar 4, 2014·2 cites·19 claims
- 2570US7781868B2Semiconductor components having through interconnects and backside redistribution conductorsMICRON TECHNOLOGY INC·Filed 2009·Granted Aug 24, 2010·3 cites·31 claims
- 2668US9166634B2Electronic device with multiple antenna feeds and adjustable filter and matching circuitryAPPLE INC·Filed 2013·Granted Oct 20, 2015·2 cites·20 claims
- 2766US9054165B2Semiconductor devices including a through-substrate conductive member with an exposed endPRATT DAVID S·Filed 2012·Granted Jun 9, 2015·1 cites·11 claims
- 2865US8779605B2Method and apparatus providing integrated circuit having redistribution layer with recessed connectorsPRATT DAVID·Filed 2012·Granted Jul 15, 2014·1 cites·5 claims
- 2965US7792799B2Backing up a wireless computing devicePERLEGO SYSTEMS INC·Filed 2003·Granted Sep 7, 2010·16 cites·15 claims
- 3065US2023163030A1Methods for forming conductive vias, and associated devices and systemsMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 3164US11574842B2Methods for forming conductive vias, and associated devices and systemsMICRON TECHNOLOGY INC·Filed 2021·Granted Feb 7, 2023·0 cites·14 claims
- 3264US8314497B2Surface depressions for die-to-die interconnects and associated systemsPRATT DAVID S·Filed 2010·Granted Nov 20, 2012·1 cites·23 claims
- 3361US7812461B2Method and apparatus providing integrated circuit having redistribution layer with recessed connectorsMICRON TECHNOLOGY INC·Filed 2007·Granted Oct 12, 2010·1 cites·19 claims
- 3457US9842806B2Stacked semiconductor devicesMICRON TECHNOLOGY INC·Filed 2017·Granted Dec 12, 2017·0 cites·18 claims
- 3557US9355934B2Method and apparatus providing integrated circuit having redistribution layer with recessed connectorsMICRON TECHNOLOGY INC·Filed 2014·Granted May 31, 2016·0 cites·13 claims
- 3655US8766458B2Surface depressions for die-to-die interconnects and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2012·Granted Jul 1, 2014·0 cites·14 claims
- 3755US2019058789A1Method and apparatus for remote control and updating of wireless mobile devicesGULA CONSULTING LLC·Filed 2018·Application pending·0 cites
- 3854US9418970B2Redistribution layers for microfeature workpieces, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2015·Granted Aug 16, 2016·0 cites·20 claims
- 3954US8994163B2Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devicesMICRON TECHNOLOGY INC·Filed 2013·Granted Mar 31, 2015·0 cites·21 claims
- 4052US10020287B2Pass-through interconnect structure for microelectronic dies and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2015·Granted Jul 10, 2018·0 cites·14 claims
- 4151US8274163B2Method and apparatus providing integrated circuit having redistribution layer with recessed connectorsPRATT DAVID·Filed 2011·Granted Sep 25, 2012·0 cites·10 claims
- 4250US10057415B2Method and apparatus for remote control and updating of wireless mobile devicesGULA CONSULTING LLC·Filed 2015·Granted Aug 21, 2018·0 cites·13 claims
- 4350US9230859B2Redistribution layers for microfeature workpieces, and associated systems and methodsPRATT DAVID·Filed 2011·Granted Jan 5, 2016·0 cites·20 claims
- 4450US5590209AMount for supporting a microphone on a helmetSETCOM CORP·Filed 1994·Granted Dec 31, 1996·40 cites·21 claims
- 4549US9324721B2Pitch-halving integrated circuit processNANYA TECHNOLOGY CORP·Filed 2015·Granted Apr 26, 2016·0 cites·10 claims
- 4649US2006073820A1Method and apparatus for remote control and updating of wireless mobile devicesCRASWELL RONALD J·Filed 2003·Application pending·0 cites
- 4748US9245844B2Pitch-halving integrated circuit process and integrated circuit structure made therebyPRATT DAVID STORRS·Filed 2013·Granted Jan 26, 2016·0 cites·6 claims
- 4846US2010052157A1Channel for a semiconductor die and methods of formationMICRON TECHNOLOGY INC·Filed 2008·Application pending·0 cites
- 4944US11784077B2Wafer overlay marks, overlay measurement systems, and related methodsMICRON TECHNOLOGY INC·Filed 2019·Granted Oct 10, 2023·0 cites·19 claims
- 5029USD363934SHelmet attachment for a microphoneSETCOM CORP·Filed 1994·Granted Nov 7, 1995·1 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →