Inventor · disambiguated record
Damien M. Pricolo
Also filed as: PRICOLO DAMIEN M
4 granted patents·4 citations·filing 2013–2021
64Inventor score
Technology areasH10P
Top patents by PatentIndex Score
4 records- 0184US9620413B2Semiconductor device and method of using a standardized carrier in semiconductor packagingSTATS CHIPPAC LTD·Filed 2013·Granted Apr 11, 2017·4 cites·25 claims
- 0274US11961764B2Semiconductor device and method of making a wafer-level chip-scale packageSTATS CHIPPAC PTE LTD·Filed 2021·Granted Apr 16, 2024·0 cites·17 claims
- 0363US11011423B2Semiconductor device and method of using a standardized carrier in semiconductor packagingSTATS CHIPPAC PTE LTD·Filed 2018·Granted May 18, 2021·0 cites·19 claims
- 0458US10181423B2Semiconductor device and method of using a standardized carrier in semiconductor packagingSTATS CHIPPAC PTE LTD·Filed 2017·Granted Jan 15, 2019·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →