Inventor · disambiguated record
David Alan Pruitt
Also filed as: PRUITT DAVID · PRUITT DAVID A · PRUITT DAVID ALAN
13 granted patents·2 pending applications·88 citations·filing 1995–2020
90Inventor score
Files withLINEAR TECHN INC7PRUITT DAVID ALAN2ANALOG DEVICES INTERNATIONAL UNLIMITED CO1LINEAR TECH CORP1MAXIM INTEGRATED PRODUCTS1
Top patents by PatentIndex Score
15 records- 0191US8076181B1Lead plating technique for singulated IC packagesPRUITT DAVID A·Filed 2010·Granted Dec 13, 2011·29 cites·9 claims
- 0283US8163643B1Enhanced pad design for solder attach devicesOTHIENO MAURICE O·Filed 2010·Granted Apr 24, 2012·12 cites·20 claims
- 0378US8492884B2Stacked interposer leadframesPRUITT DAVID ALAN·Filed 2010·Granted Jul 23, 2013·5 cites·15 claims
- 0475US8269355B2Flexible contactless wire bonding structure and methodology for semiconductor devicePRUITT DAVID ALAN·Filed 2010·Granted Sep 18, 2012·4 cites·8 claims
- 0574US11272618B2Mechanically-compliant and electrically and thermally conductive leadframes for component-on-package circuitsANALOG DEVICES INTERNATIONAL UNLIMITED CO·Filed 2017·Granted Mar 8, 2022·2 cites·16 claims
- 0672US6703692B1Leadframe with support membersLINEAR TECHN INC·Filed 2002·Granted Mar 9, 2004·20 cites·45 claims
- 0762US8921159B2Stacked interposer leadframesLINEAR TECHN INC·Filed 2013·Granted Dec 30, 2014·1 cites·16 claims
- 0862US7902665B2Semiconductor device having a suspended isolating interconnectLINEAR TECHN INC·Filed 2008·Granted Mar 8, 2011·2 cites·34 claims
- 0954US11296019B1Vertically structured pad systemMAXIM INTEGRATED PRODUCTS·Filed 2020·Granted Apr 5, 2022·0 cites·20 claims
- 1052US2017311447A1Mechanically-compliant and electrically and thermally conductive leadframes for component-on-package circuitsLINEAR TECH CORP·Filed 2017·Application pending·0 cites
- 1151US7960845B2Flexible contactless wire bonding structure and methodology for semiconductor deviceLINEAR TECHN INC·Filed 2008·Granted Jun 14, 2011·0 cites·17 claims
- 1251US7154165B2Flashless lead frame with horizontal singulationLINEAR TECHN INC·Filed 2004·Granted Dec 26, 2006·5 cites·4 claims
- 1346US7414302B2Flashless lead frame with horizontal singulationLINEAR TECHN INC·Filed 2006·Granted Aug 19, 2008·0 cites·11 claims
- 1438US5518684AMethod of making a molded lead frameNAT SEMICONDUCTOR CORP·Filed 1995·Granted May 21, 1996·8 cites·7 claims
- 1530US2016035645A1Exposed, solderable heat spreader for flipchip packagesLINEAR TECHN INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →