Inventor · disambiguated record
Daniel Lee Revier
Also filed as: REVIER DANIEL LEE
32 granted patents·3 pending applications·42 citations·filing 2017–2024
94Inventor score
Files withTEXAS INSTRUMENTS INC35
Top patents by PatentIndex Score
35 records- 0198US10908414B2Lens cleaning via electrowettingTEXAS INSTRUMENTS INC·Filed 2017·Granted Feb 2, 2021·17 cites·24 claims
- 0293US11693235B2Lens cleaning via electrowettingTEXAS INSTRUMENTS INC·Filed 2021·Granted Jul 4, 2023·2 cites·15 claims
- 0386US11865773B2Additive process for circular printing of electronic devicesTEXAS INSTRUMENTS INC·Filed 2019·Granted Jan 9, 2024·3 cites·24 claims
- 0486US11854933B2Thermally conductive wafer layerTEXAS INSTRUMENTS INC·Filed 2020·Granted Dec 26, 2023·1 cites·17 claims
- 0586US10910465B23D printed semiconductor packageTEXAS INSTRUMENTS INC·Filed 2018·Granted Feb 2, 2021·3 cites·14 claims
- 0684US10780467B2Methods and apparatus for surface wetting controlTEXAS INSTRUMENTS INC·Filed 2017·Granted Sep 22, 2020·3 cites·15 claims
- 0783US12457756B23D printed semiconductor packageTEXAS INSTRUMENTS INC·Filed 2024·Granted Oct 28, 2025·0 cites·20 claims
- 0881US12046430B2Liquid metal MEMS switchTEXAS INSTRUMENTS INC·Filed 2023·Granted Jul 23, 2024·0 cites·15 claims
- 0981US10371891B2Integrated circuit with dielectric waveguide connector using photonic bandgap structureTEXAS INSTRUMENTS INC·Filed 2017·Granted Aug 6, 2019·3 cites·21 claims
- 1080US10444432B2Galvanic signal path isolation in an encapsulated package using a photonic structureTEXAS INSTRUMENTS INC·Filed 2017·Granted Oct 15, 2019·3 cites·18 claims
- 1177US12172374B2Additive process for circular printingTEXAS INSTRUMENTS INC·Filed 2023·Granted Dec 24, 2024·0 cites·20 claims
- 1275US11031364B2Nanoparticle backside die adhesion layerTEXAS INSTRUMENTS INC·Filed 2018·Granted Jun 8, 2021·2 cites·8 claims
- 1374US10557754B2Spectrometry in integrated circuit using a photonic bandgap structureTEXAS INSTRUMENTS INC·Filed 2017·Granted Feb 11, 2020·1 cites·18 claims
- 1473US10788367B2Integrated circuit using photonic bandgap structureTEXAS INSTRUMENTS INC·Filed 2019·Granted Sep 29, 2020·1 cites·18 claims
- 1573US2024153841A1Thermally conductive wafer layerTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 1671US11869925B23D printed semiconductor packageTEXAS INSTRUMENTS INC·Filed 2021·Granted Jan 9, 2024·0 cites·16 claims
- 1770US10622270B2Integrated circuit package with stress directing materialTEXAS INSTRUMENTS INC·Filed 2017·Granted Apr 14, 2020·1 cites·16 claims
- 1869US10497651B2Electromagnetic interference shield within integrated circuit encapsulation using photonic bandgap structureTEXAS INSTRUMENTS INC·Filed 2017·Granted Dec 3, 2019·1 cites·23 claims
- 1968US12042829B2Methods and apparatus for surface wetting controlTEXAS INSTRUMENTS INC·Filed 2020·Granted Jul 23, 2024·0 cites·14 claims
- 2068US10879151B2Semiconductor package with liquid metal conductorsTEXAS INSTRUMENTS INC·Filed 2018·Granted Dec 29, 2020·1 cites·20 claims
- 2165US11417540B23D printed semiconductor packageTEXAS INSTRUMENTS INC·Filed 2020·Granted Aug 16, 2022·0 cites·18 claims
- 2264US11676930B2Nanoparticle backside die adhesion layerTEXAS INSTRUMENTS INC·Filed 2021·Granted Jun 13, 2023·0 cites·18 claims
- 2364US2022336217A1Microelectronic device substrate formed by additive processTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 2463US11728111B2Liquid metal MEMS switchTEXAS INSTRUMENTS INC·Filed 2018·Granted Aug 15, 2023·0 cites·23 claims
- 2559US10553573B2Self-assembly of semiconductor die onto a leadframe using magnetic fieldsTEXAS INSTRUMENTS INC·Filed 2017·Granted Feb 4, 2020·0 cites·18 claims
- 2657US10861715B23D printed semiconductor packageTEXAS INSTRUMENTS INC·Filed 2018·Granted Dec 8, 2020·0 cites·4 claims
- 2756US11404270B2Microelectronic device substrate formed by additive processTEXAS INSTRUMENTS INC·Filed 2018·Granted Aug 2, 2022·0 cites·9 claims
- 2855US10886187B2Thermal management in integrated circuit using phononic bandgap structureTEXAS INSTRUMENTS INC·Filed 2017·Granted Jan 5, 2021·0 cites·12 claims
- 2954US11355414B2Nanoparticle matrix for backside heat spreadingTEXAS INSTRUMENTS INC·Filed 2019·Granted Jun 7, 2022·0 cites·20 claims
- 3053US11607704B2Methods and apparatus for electrostatic control of expelled material for lens cleanersTEXAS INSTRUMENTS INC·Filed 2017·Granted Mar 21, 2023·0 cites·23 claims
- 3147US11271296B2Molded packaged antennaTEXAS INSTRUMENTS INC·Filed 2018·Granted Mar 8, 2022·0 cites·26 claims
- 3247US10833648B2Acoustic management in integrated circuit using phononic bandgap structureTEXAS INSTRUMENTS INC·Filed 2017·Granted Nov 10, 2020·0 cites·17 claims
- 3347US10170384B2Methods and apparatus providing a graded package for a semiconductorTEXAS INSTRUMENTS INC·Filed 2017·Granted Jan 1, 2019·0 cites·11 claims
- 3446US11487206B2Methods and apparatus for digital material deposition onto semiconductor wafersTEXAS INSTRUMENTS INC·Filed 2019·Granted Nov 1, 2022·0 cites·19 claims
- 3539US2019204505A1Additive photonic interconnects in microelectronic deviceTEXAS INSTRUMENTS INC·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →